Molex 87759 Series Vertical Surface Mount PCB Header, 14 Contact(s), 2 mm Pitch, 2 Row, Unshrouded

小計(1 管,共 148 件)*

TWD10,164.00

(不含稅)

TWD10,672.20

(含稅)

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  • 準備從 2026年7月13日 起發貨
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1 +TWD10,164.00TWD68.676

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RS庫存編號:
691-377
製造零件編號:
87759-1450
製造商:
Molex
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品牌

Molex

Product Type

PCB Header

Series

87759

Current

2A

Pitch

2mm

Number of Contacts

14

Housing Material

High Temperature Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Surface Mount

Connector System

Board-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Termination Type

Surface Mount

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

125°C

Standards/Approvals

EU RoHS, UL E29179

Voltage

125V

COO (Country of Origin):
ID
The Molex Milli Grid Header is expertly designed for seamless board-to-board and signal applications, featuring a surface mount vertical configuration. This product ensures robust connectivity with its 14 circuits, while also prioritising efficiency with a lead-free construction and a selective gold plating of 0.38μm. Its high-temperature thermoplastic housing and phosphor bronze metal composition enhance durability, ensuring performance is maintained across a wide temperature range of -55° to +125°C. The milli-grid header is Ideal for modern electronic applications, perfectly balancing quality and reliability in a Compact design, making it an essential component for Advanced PCB connections.

Active status ensures availability for immediate integration into projects
Designed for both board-to-board and signal applications, maximising versatility
Surface mount functionality simplifies installation process on PCBs
Incorporates lead-free materials, adhering to environmentally conscious standards
High durability with a mating cycle rating of 100, facilitating long-term use
Black resin ensures aesthetic appeal and reduces light reflection
Flexible mounting with stackable options enhances design adaptability
PCB retention features enhance connection integrity during operation

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