Molex 55763 Series Vertical Surface PCB Header, 40 Contact(s), 2 mm Pitch, 2 Row, Shrouded

N

小計(1 卷,共 300 件)*

TWD46,951.00

(不含稅)

TWD49,298.55

(含稅)

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  • 準備從 2026年7月13日 起發貨
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RS庫存編號:
691-302
製造零件編號:
55763-4070
製造商:
Molex
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品牌

Molex

Series

55763

Product Type

PCB Header

Pitch

2mm

Current

3A

Number of Contacts

40

Housing Material

High Temperature Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Surface

Contact Material

Brass

Contact Plating

Tin

Row Pitch

2mm

Termination Type

Surface Mount

Minimum Operating Temperature

-25°C

Maximum Operating Temperature

105°C

Contact Gender

Male

Tail Pin Length

4.50mm

Standards/Approvals

REACH SVHC

Voltage

250Vrms

COO (Country of Origin):
JP
The Molex MicroClasp Wire-to-Board Header is an Advanced connectivity solution designed for precise applications in PCB assemblies. With a 2.00mm pitch and a robust dual-row construction, this surface mount header accommodates up to 40 circuits, ensuring reliable signal transmission. Its natural resin construction and high-temperature thermoplastic material guarantee durability and resistance to operational stress. Ideal for signal applications, it prioritises efficient connections, thanks to its designed mating features and secure locking mechanism. Optimised for versatility, this header is suited for various electronic environments, making it a staple in PCB header and receptacle categories.

Supports a maximum current of 3.0A and voltage of 250V for reliable electrical performance

Dual-row design enhances circuit density while maintaining compactness

Surface mount capability facilitates easy integration into diverse PCB designs

Natural resin construction ensures durability against thermal and mechanical stress

Locking mechanism secures the mating part, enhancing connection stability

Compliance with EU RoHS regulations underlines its commitment to environmental standards

Operating temperature range of -25° to +85°C supports a variety of application environments

Embossed tape packaging on reel allows for efficient handling and assembly processe

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