Molex 30069 Series Vertical Through Hole PCB Header, 2 Contact(s), 4.2 mm Pitch, 2 Row, Shrouded

N

小計(1 袋,共 250 件)*

TWD12,400.00

(不含稅)

TWD13,020.00

(含稅)

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  • 2026年6月08日 發貨
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每袋
每單位*
1 +TWD12,400.00TWD49.60

* 參考價格

RS庫存編號:
684-902
製造零件編號:
15-97-7023
製造商:
Molex
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品牌

Molex

Series

30069

Product Type

PCB Header

Pitch

4.2mm

Current

13A

Number of Contacts

2

Housing Material

Polyester

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Contact Plating

Tin

Contact Material

Brass

Minimum Operating Temperature

-40°C

Termination Type

Solder

Row Pitch

4.2mm

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS

Voltage

600 V

COO (Country of Origin):
MX
The Molex mini-fit tpa header is an advanced connectivity solution designed for reliable power and signal distribution in a variety of applications. Featuring a dual-row configuration with 2 circuits this header stands out with its secure snap-in plastic peg PCB lock ensuring stability during operation. Engineered to support a maximum current of 13.0A per circuit the connector facilitates both wire to wire and wire to board connections with ease. Its robust construction is complemented by high-quality tin plating enhancing durability and performance. Operating effectively across a temperature range of -40° to +105°C this product is perfect for demanding environments. With excellent PCB retention and a recommended thickness of 1.80mm this header represents an optimal choice for manufacturers seeking efficiency and reliability in their designs.

Designed for efficient power and wire to board applications

Secure snap-in plastic peg PCB lock for enhanced connection stability

Durable construction with tin plating for superior longevity

Recommended PCB thickness of 1.80mm for seamless integration

Offers excellent PCB retention for reliable performance over time

Compatible with Mini-Fit receptacles and connectors for versatile installation options

Adheres to industry compliance standards which enhancing trust and reliability

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