Molex 216571 Series Vertical Through Hole PCB Header, 3 Contact(s), 3 mm Pitch, 1 Row, Shrouded
- RS庫存編號:
- 684-828
- 製造零件編號:
- 216571-3003
- 製造商:
- Molex
N
小計（1 托盤，共 120 件）*
TWD8,242.00
(不含稅)
TWD8,654.10
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年2月02日 發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
托盤 | 每托盤 | 每單位* |
|---|---|---|
| 1 + | TWD8,242.00 | TWD68.683 |
* 參考價格
- RS庫存編號:
- 684-828
- 製造零件編號:
- 216571-3003
- 製造商:
- Molex
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產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Series | 216571 | |
| Product Type | PCB Header | |
| Pitch | 3mm | |
| Number of Contacts | 3 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Row Pitch | 3mm | |
| Standards/Approvals | RoHS | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Series 216571 | ||
Product Type PCB Header | ||
Pitch 3mm | ||
Number of Contacts 3 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Row Pitch 3mm | ||
Standards/Approvals RoHS | ||
- COO (Country of Origin):
- CN
The Molex Micro-Fit+ Vertical Header designed to facilitate efficient power and signal connections within various electronic applications. This robust header, with a 3.00mm pitch and three circuits, ensures reliable performance in demanding environments, thanks to its glow-wire capability. Constructed from high copper alloy and featuring a matte tin plated termination, it combines durability with excellent electrical characteristics. Operating over a temperature range of -40° to +125°C, this component is ideal for long-lasting connections. Its one-row design enhances space optimisation on PCBs, while features like PCB retention and compatibility with standard housings make it an essential choice for users aiming for reliability and efficiency in their wire-to-board connections.
Glow wire capable for enhanced safety in structural applications
Designed with a vertical orientation for compact PCB layouts
Robust one row, three circuit design maximises space efficiency
Constructed with high copper alloy for superior conductivity
Matte tin plating for improved solderability and corrosion resistance
Durability rating of 200 mating cycles ensures long term reliability
Utilises lead free solder process capability for eco friendly manufacturing
Locking features to mating parts enhance connection stability
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