Molex 41772 Series Right Angle Through Hole PCB Header, 6 Contact(s), 3.96 mm Pitch, 1 Row, Unshrouded
- RS庫存編號:
- 684-189
- 製造零件編號:
- 26-60-3082
- 製造商:
- Molex
N
小計(1 包,共 250 件)*
TWD8,585.00
(不含稅)
TWD9,014.25
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年2月02日 發貨
**需要更多嗎?**輸入您需要的數量,然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
包 | 每包 | 每單位* |
|---|---|---|
| 1 + | TWD8,585.00 | TWD34.34 |
* 參考價格
- RS庫存編號:
- 684-189
- 製造零件編號:
- 26-60-3082
- 製造商:
- Molex
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Series | 41772 | |
| Product Type | PCB Header | |
| Pitch | 3.96mm | |
| Current | 7A | |
| Number of Contacts | 6 | |
| Housing Material | Polyester | |
| Number of Rows | 1 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Unshrouded | |
| Mount Type | Through Hole | |
| Contact Plating | Tin | |
| Contact Material | Brass | |
| Termination Type | Solder | |
| Row Pitch | 3.96mm | |
| Tail Pin Length | 3.56mm | |
| Standards/Approvals | RoHS | |
| Voltage | 250 V | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Series 41772 | ||
Product Type PCB Header | ||
Pitch 3.96mm | ||
Current 7A | ||
Number of Contacts 6 | ||
Housing Material Polyester | ||
Number of Rows 1 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Unshrouded | ||
Mount Type Through Hole | ||
Contact Plating Tin | ||
Contact Material Brass | ||
Termination Type Solder | ||
Row Pitch 3.96mm | ||
Tail Pin Length 3.56mm | ||
Standards/Approvals RoHS | ||
Voltage 250 V | ||
- COO (Country of Origin):
- IN
The Molex KK 156 Header Assembly is an 8‑position, right‑angle wire‑to‑board header assembly. Designed for through‑hole PCB mounting, it features unshrouded male pins configured at a 90° orientation for space-efficient board layouts. This robust connector delivers reliable connectivity for moderate-current applications, and its standardized pitch ensures compatibility with a variety of matching housings and crimped wire assemblies.
Exceptional durability through the use of high quality materials
Effortless installation due to user friendly design elements
Versatile application suitability across various electronic devices and systems
Enhanced resistance to environmental conditions, ensuring long term reliability
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