Molex 172064 Series Right Angle Through Hole PCB Header, 12 Contact(s), 5.7 mm Pitch, 2 Row, Shrouded
- RS庫存編號:
- 683-579
- 製造零件編號:
- 172064-0012
- 製造商:
- Molex
N
小計（1 托盤，共 20 件）*
TWD10,698.00
(不含稅)
TWD11,232.90
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年6月30日 發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
托盤 | 每托盤 | 每單位* |
|---|---|---|
| 1 + | TWD10,698.00 | TWD534.90 |
* 參考價格
- RS庫存編號:
- 683-579
- 製造零件編號:
- 172064-0012
- 製造商:
- Molex
規格
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產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Series | 172064 | |
| Product Type | PCB Header | |
| Pitch | 5.7mm | |
| Number of Contacts | 12 | |
| Number of Rows | 2 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Through Hole | |
| Row Pitch | 5.7mm | |
| Standards/Approvals | RoHS | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Series 172064 | ||
Product Type PCB Header | ||
Pitch 5.7mm | ||
Number of Contacts 12 | ||
Number of Rows 2 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Through Hole | ||
Row Pitch 5.7mm | ||
Standards/Approvals RoHS | ||
- COO (Country of Origin):
- CN
The Molex Mega-Fit right-angle header is expertly designed for efficient power and wire-to-board applications. This component features 12 circuits, ensuring optimal connectivity and reliable performance. Built with a 5.70mm pitch, it accommodates a variety of PCB thicknesses, making it versatile for multiple designs. The header boasts a gold plating for the mating interface, enhancing conductivity, while the matte tin plating for termination ensures durability. Its UL 94 V-0 rating confirms its resistance to flame, and the glow-wire capability further exemplifies its safety standards. With a black high-temperature thermoplastic resin construction, it combines sturdiness with functionality for seamless integration into existing systems.
Constructed from black high-temperature thermoplastic resin for durability
Mated height of 16.78mm allows for stable connections
PCB retention features provide secure placement within assemblies
Compatible with lead-free solder processes for eco-friendly manufacturing
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