TE Connectivity AMPMODU Series Vertical Board Connector Assembly, 6 Contact(s), 2.54 mm Pitch, 1 Row, Unshrouded

小計(1 盒,共 250 件)*

TWD6,195.00

(不含稅)

TWD6,504.75

(含稅)

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  • 2026年6月29日 發貨
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RS庫存編號:
680-447
製造零件編號:
826937-6
製造商:
TE Connectivity
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品牌

TE Connectivity

Series

AMPMODU

Product Type

Connector Assembly

Pitch

2.54mm

Current

5A

Housing Material

PBT

Number of Contacts

6

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Tin

Contact Material

Phosphor Bronze

Row Pitch

2mm

Termination Type

Through Hole

Minimum Operating Temperature

-65°C

Maximum Operating Temperature

105°C

Contact Gender

Male

Tail Pin Length

2.5mm

Voltage

750Vrms

COO (Country of Origin):
PL
The TE Connectivity PCB Mount Header offers a reliable solution for connecting printed circuit boards using a vertical, board to board configuration. With its six positions and a 2.54 mm [.1 in] centreline, this connector designed for seamless integration in a variety of applications, ensuring effective and efficient signal transfer. Constructed with a breakaway header type, it provides flexibility in production and assembly, making it Ideal for automated processes. The connector's robust design, featuring tin plating and a through hole solder terminations, ensures durability and long lasting performance in operational environments. The product is also compliant with industry standards, making it a dependable choice for electronic assemblies.

PCB Mount Header type Ideal for secure vertical positioning
Six positions accommodate essential connectivity needs
2.54 mm centreline allows for standardised integration
Breakaway design simplifies assembly and enhances versatility
Tin plating enhances corrosion resistance for longevity
Through Hole Solder terminations ensure robust joints
Voltage rating up to 750 Vrms supports a range of applications
Compatible with various TE parts supporting diverse circuitry
Designed for fully loaded contact conditions to maximise performance
Insulation resistance of 5000 MΩ ensuring reliable signal integrity

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