TE Connectivity AMP-HDI Series Vertical Board Connector Assembly, 120 Contact(s), 2.54 mm Pitch, 3 Row, Shrouded
- RS庫存編號:
- 679-398
- 製造零件編號:
- 5532447-5
- 製造商:
- TE Connectivity
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- RS庫存編號:
- 679-398
- 製造零件編號:
- 5532447-5
- 製造商:
- TE Connectivity
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | TE Connectivity | |
| Product Type | Connector Assembly | |
| Series | AMP-HDI | |
| Current | 3A | |
| Pitch | 2.54mm | |
| Housing Material | Thermoplastic | |
| Number of Contacts | 120 | |
| Number of Rows | 3 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Board | |
| Connector System | Board-to-Board | |
| Contact Plating | Gold | |
| Contact Material | Phosphor Bronze | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -65°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 125°C | |
| Tail Pin Length | 6.35mm | |
| Standards/Approvals | UL | |
| 選取全部 | ||
|---|---|---|
品牌 TE Connectivity | ||
Product Type Connector Assembly | ||
Series AMP-HDI | ||
Current 3A | ||
Pitch 2.54mm | ||
Housing Material Thermoplastic | ||
Number of Contacts 120 | ||
Number of Rows 3 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Board | ||
Connector System Board-to-Board | ||
Contact Plating Gold | ||
Contact Material Phosphor Bronze | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -65°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 125°C | ||
Tail Pin Length 6.35mm | ||
Standards/Approvals UL | ||
- COO (Country of Origin):
- US
The TE Connectivity Pin Assembly designed for vertical mounting in high-density interconnect (HDI) applications where precision and compactness are critical. It supports lead-free compliance, making it suitable for environmentally conscious manufacturing processes. Engineered for Advanced PCB layouts, it ensures reliable performance in space-constrained electronic systems.
Vertical orientation optimized for HDI configurations
Lead-free construction aligned with RoHS standards
Suitable for fine-pitch PCB designs requiring high signal integrity
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