TE Connectivity Micro Stack Series Vertical Board Connector Assembly, 80 Contact(s), 600 μm Pitch, 2 Row, Shrouded
- RS庫存編號:
- 677-531
- 製造零件編號:
- 6376611-1
- 製造商:
- TE Connectivity
小計（1 托盤，共 60 件）*
TWD8,335.00
(不含稅)
TWD8,751.75
(含稅)
庫存資訊目前無法存取 - 請稍後再回來查看
托盤 | 每托盤 | 每單位* |
|---|---|---|
| 1 + | TWD8,335.00 | TWD138.917 |
* 參考價格
- RS庫存編號:
- 677-531
- 製造零件編號:
- 6376611-1
- 製造商:
- TE Connectivity
規格
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | TE Connectivity | |
| Product Type | Connector Assembly | |
| Series | Micro Stack | |
| Pitch | 600μm | |
| Current | 500mA | |
| Number of Contacts | 80 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Board-to-Board | |
| Mount Type | Board | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Surface Mount | |
| Maximum Operating Temperature | 85°C | |
| Contact Gender | Male | |
| Standards/Approvals | UL | |
| Voltage | 10V | |
| 選取全部 | ||
|---|---|---|
品牌 TE Connectivity | ||
Product Type Connector Assembly | ||
Series Micro Stack | ||
Pitch 600μm | ||
Current 500mA | ||
Number of Contacts 80 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Board-to-Board | ||
Mount Type Board | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Minimum Operating Temperature -55°C | ||
Termination Type Surface Mount | ||
Maximum Operating Temperature 85°C | ||
Contact Gender Male | ||
Standards/Approvals UL | ||
Voltage 10V | ||
- COO (Country of Origin):
- CN
The TE Connectivity PCB Mount Header is optimized for high-density board-to-board signal transmission in Compact electronic designs. With 80 positions and a fine 0.6 mm [.023 in] centerline spacing, it enables efficient routing while conserving valuable PCB real estate. Its partially shrouded vertical surface-mount configuration ensures precise mating and supports automated assembly.
80 Positions for dense signal interconnects
0.6 mm [.023 in] Centerline spacing for Compact layouts
Partially Shrouded Housing improves alignment and mechanical stability
Gold-Plated Contacts (Au) for superior conductivity and corrosion resistance
Surface-Mount Design supports streamlined board stacking and reflow soldering
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