TE Connectivity AMPMODU Series Right Angle Board Connector Assembly, 12 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

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TWD9,719.00

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TWD10,204.95

(含稅)

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RS庫存編號:
677-232
製造零件編號:
825457-6
製造商:
TE Connectivity
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品牌

TE Connectivity

Series

AMPMODU

Product Type

Connector Assembly

Current

5A

Pitch

2.54mm

Housing Material

PBT

Number of Contacts

12

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Brass

Contact Plating

Gold Flash

Minimum Operating Temperature

-65°C

Row Pitch

2.54mm

Termination Type

Through Hole

Tail Pin Length

3.2mm

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

UL

Mating Pin Length

0.64mm

Voltage

750Vrms

COO (Country of Origin):
PL
The TE Connectivity PCB Mount Header designed for reliable board-to-board connections with a compact, right-angle form factor. Featuring 12 positions configured at a 2.54 mm centreline, this breakaway header ensures seamless integration into various electronic applications. Constructed using Durable PBT material, this connector optimally withstands operating temperatures from -65°C to 105°C. With its robust design and exceptional insulation resistance of 5000 MΩ, the connector guarantees superior electrical performance, making it an Ideal choice for demanding circuits in the automotive and industrial sectors.

12-position configuration allows for effective signal routing in space-constrained designs

Right-angle orientation simplifies assembly and reduces PCB footprint

Gold-plated mating area ensures excellent conductivity and longevity

Compatible with various agency standards including CSA and UL for enhanced safety and compliance

Operating temperature range of -65°C to 105°C protects against temperature-induced failures

Board mount design enhances stability and reliability in harsh environments

Fully loaded contact load condition supports high-performance signals with minimal losses

Tin plating on PCB contact termination area enhances solderability and electrical performance

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