Molex 21452 Series Straight Through Hole PCB Header, 3 Contact(s), 1.25 mm Pitch, 1 Row, Shrouded

可享批量折扣

小計(1 包,共 20 件)*

TWD314.00

(不含稅)

TWD329.70

(含稅)

Add to Basket
選擇或輸入數量
有庫存
  • 38 件準備從其他地點送貨
**需要更多嗎?**輸入您需要的數量,然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
每包
每單位*
1 - 4TWD314.00TWD15.70
5 - 9TWD289.00TWD14.45
10 +TWD260.00TWD13.00

* 參考價格

RS庫存編號:
536-500
製造零件編號:
2145260301
製造商:
Molex
透過選取一個或多個屬性來查找類似產品。
選取全部

品牌

Molex

Product Type

PCB Header

Series

21452

Pitch

1.25mm

Housing Material

Polybutylene Terephthalate

Number of Contacts

3

Number of Rows

1

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Wire-to-Board, Wire-to-Wire

Row Pitch

1.25mm

Minimum Operating Temperature

-40°C

Termination Type

Crimp

Maximum Operating Temperature

105°C

Contact Gender

Female

Standards/Approvals

Compliant per EU 2015/863 chemSHERPA (xml) IPC 1752A Class D Molex Product Compliance Declaration, Eu RoHS REACH SVHC Low-Halogen, IEC-62474, IPC 1752A Class C

COO (Country of Origin):
VN
The Molex Micro Lock Plus TPA connector housing represents an innovative solution for secure and efficient wire to board and wire to wire connections. Designed with precision engineering, it features a compact 1.25mm pitch, enabling higher circuit densities without compromising reliability. This product boasts a low halogen formulation that aligns with environmental standards, ensuring safe usage in various applications. Its robust construction, combined with a positive locking mechanism, guarantees that connections remain stable even in demanding environments. With its sleek black design, this connector housing blends seamlessly into various electronic configurations, making it an ideal choice for modern engineering needs.

Designed for high density connectivity optimising space in compact applications

Low halogen materials ensure compliance with environmental regulations

Positive lock feature provides enhanced connection stability and security

Versatile application across wire to board and wire to wire scenarios

Streamlined aesthetics to enhance overall product design integration

相關連結