Phoenix Contact MCV Series Vertical Solder PCB Header, 13 Contact(s), 3.81 mm Pitch, 1 Row, Unshrouded

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TWD12,247.00

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TWD12,859.35

(含稅)

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  • 2026年2月27日 發貨
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RS庫存編號:
489-102
製造零件編號:
1828895
製造商:
Phoenix Contact
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品牌

Phoenix Contact

Product Type

PCB Header

Series

MCV

Pitch

3.81mm

Current

8A

Number of Contacts

13

Housing Material

Liquid Crystal Polymer

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

COMBICON MC 1.5

Mount Type

Solder

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Termination Type

Solder Mount

Row Pitch

3.81mm

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

100°C

Contact Gender

Male

Tail Pin Length

2mm

Standards/Approvals

cULus Recognised, VDE

Mating Pin Length

2mm

Voltage

160 V

COO (Country of Origin):
DE
The Phoenix Contact PCB header is designed for seamless integration into your electronic assemblies, offering unparalleled connectivity and flexibility. Ideal for applications requiring reliable performance, it features a compact design that facilitates multi-row arrangements on your PCB, making it versatile for various device configurations. The device incorporates advanced materials ensuring durability and compliance with both European and global safety standards. With a structure that supports a pin layout of linear pinning, it simplifies PCB design while enhancing user convenience. Additionally, this product has been engineered to withstand reflow soldering processes, integrating efficiency into manufacturing flows.

Designed for multiple connection technologies, optimising device design

Supports high power applications with robust current handling

Manufactured to meet demanding temperature ratings, ensuring operational stability

Ideal for reflow or wave soldering, enhancing ease of assembly

Constructed from high-quality materials that meet WEEE/RoHS standards

Integration-ready for SMT soldering processes, streamlining production cycles

Offers consistent performance under varying environmental conditions

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