TDK 4.7 μF Multilayer Ceramic Capacitor, 25V dc, ±20 %, Surface
- RS庫存編號:
- 242-7482
- 製造零件編號:
- CGA4J1X7R1E475M125AE
- 製造商:
- TDK
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
查看批量定價選項小計（1 卷，共 2000 件）*
TWD10,800.00
(不含稅)
TWD11,340.00
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 2,000 件從 2027年6月11日 起裝運發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每卷* |
|---|---|---|
| 2000 - 8000 | TWD5.40 | TWD10,800.00 |
| 10000 + | TWD5.30 | TWD10,600.00 |
* 參考價格
- RS庫存編號:
- 242-7482
- 製造零件編號:
- CGA4J1X7R1E475M125AE
- 製造商:
- TDK
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | TDK | |
| Capacitance | 4.7μF | |
| Product Type | Multilayer Ceramic Capacitor | |
| Voltage | 25V dc | |
| Package/Case | 0805 | |
| Construction | Stacked | |
| Packaging | Tape & Reel | |
| Mount Type | Surface | |
| Dielectric | X7R | |
| Tolerance | ±20 % | |
| Automotive Standard | AEC-Q200 | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Series | CGA | |
| Width | 1.25mm | |
| Length | 2mm | |
| Height | 1.25mm | |
| Standards/Approvals | REACH, RoHS | |
| Maximum Operating Temperature | 125°C | |
| 選取全部 | ||
|---|---|---|
品牌 TDK | ||
Capacitance 4.7μF | ||
Product Type Multilayer Ceramic Capacitor | ||
Voltage 25V dc | ||
Package/Case 0805 | ||
Construction Stacked | ||
Packaging Tape & Reel | ||
Mount Type Surface | ||
Dielectric X7R | ||
Tolerance ±20 % | ||
Automotive Standard AEC-Q200 | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Series CGA | ||
Width 1.25mm | ||
Length 2mm | ||
Height 1.25mm | ||
Standards/Approvals REACH, RoHS | ||
Maximum Operating Temperature 125°C | ||
The TDK soft termination CGA series, automotive grade of TDK's multilayer ceramic chip capacitor, is a product incorporating a conductive resin layer into the terminal electrodes. The resin layer protects the ceramic body from cracks by relieving stress caused by thermal shock and board flexure. It is used in applications such as fail safe design for battery line, prevention of ceramic element crack by board bending, prevention of solder crack by thermal shock, equipment such as mobile devices and smart key having a high possibility of drop.
High resistance to mechanical stress and thermal shock by resin layers
X8R and X8L type whose maximum temperature are up to 150 degree Celsius are available
C0G type having excellent stable temperature and DC-bias characteristics is also available
AEC-Q20
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