Microchip ATSAMA5D27C-CU, ARM Cortex A5 Microprocessor SAMA5D2 32bit ARM 500MHz 289-Pin LFBGA
- RS庫存編號:
- 165-5127
- 製造零件編號:
- ATSAMA5D27C-CU
- 製造商:
- Microchip
可享批量折扣
小計(1 托盤,共 119 件)*
TWD32,475.10
(不含稅)
TWD34,098.26
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年2月02日 發貨
**需要更多嗎?**輸入您需要的數量,然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每托盤* |
|---|---|---|
| 119 - 476 | TWD272.90 | TWD32,475.10 |
| 595 + | TWD245.60 | TWD29,226.40 |
* 參考價格
- RS庫存編號:
- 165-5127
- 製造零件編號:
- ATSAMA5D27C-CU
- 製造商:
- Microchip
規格
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Microchip | |
| Family Name | SAMA5D2 | |
| Device Core | ARM Cortex A5 | |
| Data Bus Width | 32bit | |
| Instruction Set Architecture | ARM | |
| Maximum Frequency | 500MHz | |
| I/O Voltage | 1.65 → 3.6V | |
| Mounting Type | Surface Mount | |
| Package Type | LFBGA | |
| Pin Count | 289 | |
| Typical Operating Supply Voltage | 1.2 V, 1.35 V, 1.5 V, 1.8 V, 3.3 V | |
| Dimensions | 14 x 14 x 1.03mm | |
| Minimum Operating Temperature | -40 °C | |
| Maximum Operating Temperature | +85 °C | |
| 選取全部 | ||
|---|---|---|
品牌 Microchip | ||
Family Name SAMA5D2 | ||
Device Core ARM Cortex A5 | ||
Data Bus Width 32bit | ||
Instruction Set Architecture ARM | ||
Maximum Frequency 500MHz | ||
I/O Voltage 1.65 → 3.6V | ||
Mounting Type Surface Mount | ||
Package Type LFBGA | ||
Pin Count 289 | ||
Typical Operating Supply Voltage 1.2 V, 1.35 V, 1.5 V, 1.8 V, 3.3 V | ||
Dimensions 14 x 14 x 1.03mm | ||
Minimum Operating Temperature -40 °C | ||
Maximum Operating Temperature +85 °C | ||
The SAMA5D2 series is a high-performance, ultra-low-power ARM Cortex-A5 processor-based MPU. The Cortex-A5 runs up to 500MHz and features the ARM NEON SIMD engine, a 128KB L2 cache and a floating-point unit. It supports multiple memories, including DDR3, LPDDR3 and QSPI Flash. It integrates powerful peripherals for connectivity: EMAC, up to 3 HS USB ports, up to 2 CAN ports, up to 2 SDIO/SD/MMC, up to 10 UARTs, and for user interface applications: TFT LCD controller, touch controllers, class D amplifier, audio PLL, and a CMOS sensor (camera) interface.
Embedded audio subsystem
0.8mm ball pitch package reduces PCB design complexity
Simple power management scheme
4-layer PCB
Ultra-Low Power Consumption:
Ultra-low-power architecture for extensive battery life
<200uA retention mode with fast wake-up
5uA in backup mode
New backup mode with DDR self-refresh
0.8mm ball pitch package reduces PCB design complexity
Simple power management scheme
4-layer PCB
Ultra-Low Power Consumption:
Ultra-low-power architecture for extensive battery life
<200uA retention mode with fast wake-up
5uA in backup mode
New backup mode with DDR self-refresh
For these non-cancellable (NC), and non-returnable (NR) products, Terms and Conditions apply.
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