Microchip SAM9X70-V/4PB-SL3 ARM926EJ-S Microprocessor SAM9X7 32 bit ARM 800 MHz 240-Pin TFBGA
- RS庫存編號:
- 775-361
- 製造零件編號:
- SAM9X70-V/4PB-SL3
- 製造商:
- Microchip
N
此圖片僅供參考，請參閲產品詳細資訊及規格
小計（1 托盤，共 176 件）*
TWD41,747.20
(不含稅)
TWD43,834.56
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年7月28日 發貨
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單位 | 每單位 | 每托盤* |
|---|---|---|
| 176 + | TWD237.20 | TWD41,747.20 |
* 參考價格
- RS庫存編號:
- 775-361
- 製造零件編號:
- SAM9X70-V/4PB-SL3
- 製造商:
- Microchip
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Microchip | |
| Product Type | Microprocessor | |
| Series | SAM9X7 | |
| Device Core | ARM926EJ-S | |
| Data Bus Width | 32bit | |
| Instruction Set Architecture | ARM | |
| Maximum Clock Frequency | 800MHz | |
| Interface Type | CAN FD, Ethernet, I2C, SPI, UART, USB | |
| Mount Type | Surface Mount | |
| Minimum Supply Voltage | 1.7V | |
| Package Type | TFBGA | |
| Pin Count | 240 | |
| Maximum Supply Voltage | 3.6V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | RoHS | |
| Automotive Standard | AEC-Q100 | |
| Number of Cores | 1 | |
| 選取全部 | ||
|---|---|---|
品牌 Microchip | ||
Product Type Microprocessor | ||
Series SAM9X7 | ||
Device Core ARM926EJ-S | ||
Data Bus Width 32bit | ||
Instruction Set Architecture ARM | ||
Maximum Clock Frequency 800MHz | ||
Interface Type CAN FD, Ethernet, I2C, SPI, UART, USB | ||
Mount Type Surface Mount | ||
Minimum Supply Voltage 1.7V | ||
Package Type TFBGA | ||
Pin Count 240 | ||
Maximum Supply Voltage 3.6V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals RoHS | ||
Automotive Standard AEC-Q100 | ||
Number of Cores 1 | ||
- COO (Country of Origin):
- TW
The Microchip Microprocessor delivers industrial-grade reliability for demanding IoT gateways and human-machine interfaces. Operating at speeds up to 800 MHz, this robust component ensures high-speed networking and Advanced security across an extended temperature range, making it a dependable choice for automotive and automation sectors.
240 ball TFBGA package
40 to 105 degrees Celsius range
NAND and eMMC Flash support
Integrated Quad SPI Interface
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