Microchip, 8 bit PIC, PIC XLP 16F Microcontroller, 32 MHz, 28kB FLASH, 28-Pin DIP
- RS庫存編號:
- 236-8895P
- 製造零件編號:
- PIC16F15356-I/SP
- 製造商:
- Microchip
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
查看批量定價選項小計 30 件 (以管提供)*
TWD2,016.00
(不含稅)
TWD2,116.80
(含稅)
訂單超過 $1,300.00 免費送貨
有庫存
- 加上 555 件從 2026年8月10日 起發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 |
|---|---|
| 30 + | TWD67.20 |
* 參考價格
- RS庫存編號:
- 236-8895P
- 製造零件編號:
- PIC16F15356-I/SP
- 製造商:
- Microchip
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Microchip | |
| Product Type | Microcontroller | |
| Series | PIC XLP 16F | |
| Package Type | DIP | |
| Mount Type | Surface | |
| Pin Count | 28 | |
| Device Core | PIC | |
| Data Bus Width | 8bit | |
| Program Memory Size | 28kB | |
| Maximum Clock Frequency | 32MHz | |
| RAM Size | 2kB | |
| Maximum Supply Voltage | 5.5V | |
| Minimum Operating Temperature | -40°C | |
| Number of Programmable I/Os | 25 | |
| DACs | 1 x 5 Bit | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | REACH, RoHS3 | |
| Width | 7.62mm | |
| Minimum Supply Voltage | 2.3V | |
| Number of Timers | 2 | |
| ADCs | 24 x 10 Bit | |
| Automotive Standard | No | |
| Instruction Set Architecture | RISC | |
| Program Memory Type | FLASH | |
| 選取全部 | ||
|---|---|---|
品牌 Microchip | ||
Product Type Microcontroller | ||
Series PIC XLP 16F | ||
Package Type DIP | ||
Mount Type Surface | ||
Pin Count 28 | ||
Device Core PIC | ||
Data Bus Width 8bit | ||
Program Memory Size 28kB | ||
Maximum Clock Frequency 32MHz | ||
RAM Size 2kB | ||
Maximum Supply Voltage 5.5V | ||
Minimum Operating Temperature -40°C | ||
Number of Programmable I/Os 25 | ||
DACs 1 x 5 Bit | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals REACH, RoHS3 | ||
Width 7.62mm | ||
Minimum Supply Voltage 2.3V | ||
Number of Timers 2 | ||
ADCs 24 x 10 Bit | ||
Automotive Standard No | ||
Instruction Set Architecture RISC | ||
Program Memory Type FLASH | ||
The Microchip microcontroller features analog, core independent peripherals and communication peripherals, combined with eXtreme low power (XLP) technology for a wide range of general purpose and low power applications. The devices feature multiple PWMs, multiple communication, temperature sensor, and memory features like Memory Access Partition (MAP) to support customers in data protection and bootloader applications, and Device Information Area (DIA) which stores factory calibration values to help improve temperature sensor accuracy.
C Compiler optimized RISC architecture
DC – 32 MHz clock input
125 ns minimum instruction cycle
Interrupt capability
16-Level deep hardware stack
8 Bit timer2 with hardware limit timer (HLT)
16-bit Timer0/1
Low current power on reset (POR)
Configurable power up timer (PWRTE)
Brown out reset (BOR)
low power BOR (LPBOR) option
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