TE Connectivity 0.6 mm Pitch 204 Way, Right Angle Board Mount DDR3 DIMM Socket ,1.5V, 0.5A
- RS庫存編號:
- 786-343
- 製造零件編號:
- 2013289-2
- 製造商:
- TE Connectivity
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- RS庫存編號:
- 786-343
- 製造零件編號:
- 2013289-2
- 製造商:
- TE Connectivity
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | TE Connectivity | |
| Memory Socket Type | Memory Card | |
| Product Type | DIMM Socket | |
| Orientation | Right Angle | |
| Contact Material | Copper Alloy | |
| Current | 0.5A | |
| Contact Plating | Gold | |
| Number of Contacts | 204 | |
| Pitch | 0.6mm | |
| Mount Type | Board | |
| Housing Material | High Temperature Thermoplastic | |
| SDRAM Type | DDR3 | |
| Minimum Operating Temperature | -55°C | |
| Latching | Yes | |
| Termination Type | Surface Mount | |
| Maximum Operating Temperature | 85°C | |
| Row Spacing | 8.2mm | |
| Maximum Contact Resistance | 50mΩ | |
| Standards/Approvals | UL 94V-0 | |
| Series | DDR3 SODIMM | |
| Voltage | 1.5V | |
| 選取全部 | ||
|---|---|---|
品牌 TE Connectivity | ||
Memory Socket Type Memory Card | ||
Product Type DIMM Socket | ||
Orientation Right Angle | ||
Contact Material Copper Alloy | ||
Current 0.5A | ||
Contact Plating Gold | ||
Number of Contacts 204 | ||
Pitch 0.6mm | ||
Mount Type Board | ||
Housing Material High Temperature Thermoplastic | ||
SDRAM Type DDR3 | ||
Minimum Operating Temperature -55°C | ||
Latching Yes | ||
Termination Type Surface Mount | ||
Maximum Operating Temperature 85°C | ||
Row Spacing 8.2mm | ||
Maximum Contact Resistance 50mΩ | ||
Standards/Approvals UL 94V-0 | ||
Series DDR3 SODIMM | ||
Voltage 1.5V | ||
- COO (Country of Origin):
- CN
The TE Connectivity DIMM socket is designed to meet interconnect specifications for High speed data applications. It supports performance across various platforms including servers and communications equipment.
Compatible with JEDEC industry standards for reliability
Available with gold plating options for enhanced conductivity
Offered in a right-angle surface mount for easy installation
Packaged with a choice of tray or reel for convenience
Designed for applications requiring Peak performance and speed
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