Molex 0.85 mm Pitch 288 Way, Vertical Through Hole Mount DDR4 Socket ,29V, 0.75A
- RS庫存編號:
- 693-666
- 製造零件編號:
- 78726-1012
- 製造商:
- Molex
N
小計（1 托盤，共 60 件）*
TWD8,294.00
(不含稅)
TWD8,708.70
(含稅)
訂單超過 $1,300.00 免費送貨
製造商存貨
- 準備從 2026年7月02日 起發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
托盤 | 每托盤 | 每單位* |
|---|---|---|
| 1 + | TWD8,294.00 | TWD138.233 |
* 參考價格
- RS庫存編號:
- 693-666
- 製造零件編號:
- 78726-1012
- 製造商:
- Molex
規格
產品概覽和技術數據資料表
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產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Memory Socket Type | DIMM | |
| Product Type | Socket | |
| Orientation | Vertical | |
| Insertion/Removal Method | Latched | |
| Current | 0.75A | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold over Tin | |
| Number of Contacts | 288 | |
| Pitch | 0.85mm | |
| Mount Type | Through Hole | |
| Housing Material | Nylon | |
| SDRAM Type | DDR4 | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -55°C | |
| Latching | Yes | |
| Maximum Operating Temperature | 85°C | |
| Row Spacing | 1.58mm | |
| Standards/Approvals | CSA LR19980 | |
| Voltage | 29V | |
| Series | 78726 | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Memory Socket Type DIMM | ||
Product Type Socket | ||
Orientation Vertical | ||
Insertion/Removal Method Latched | ||
Current 0.75A | ||
Contact Material Copper Alloy | ||
Contact Plating Gold over Tin | ||
Number of Contacts 288 | ||
Pitch 0.85mm | ||
Mount Type Through Hole | ||
Housing Material Nylon | ||
SDRAM Type DDR4 | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -55°C | ||
Latching Yes | ||
Maximum Operating Temperature 85°C | ||
Row Spacing 1.58mm | ||
Standards/Approvals CSA LR19980 | ||
Voltage 29V | ||
Series 78726 | ||
- COO (Country of Origin):
- CN
The Molex DDR4 DIMM Socket is engineered for vertical through-hole applications, specifically designed to meet the rigorous demands of modern memory module connectivity. This component features a robust construction with 288 circuits, ensuring seamless integration and reliable performance in high-density PCB environments. The precision gold plating provides exceptional conductivity and durability, while the low-halogen materials contribute to environmentally conscious designs. With a recommended PCB thickness of 1.57mm, this socket supports optimal electrical and thermal management, making it Ideal for diverse applications in the realm of memory modules.
288 circuits for high density memory module support
Vertical through-hole design ensures optimal mounting stability
Gold plating for superior electrical conductivity and longevity
Low-halogen materials comply with environmental safety standards
Black housing and latch provide secure and discreet integration
Durable construction rated for up to 25 mating cycles
Compatible with JEDEC MO-309 outline for standardised fit
Designed to operate effectively within a temperature range of -55° to +85°C.
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