TE Connectivity 1.27 mm Pitch 80 Way, Vertical Board Mount Memory Socket ,0.6kV, 1A
- RS庫存編號:
- 679-214
- 製造零件編號:
- 5822030-4
- 製造商:
- TE Connectivity
N
小計（1 包，共 45 件）*
TWD6,290.00
(不含稅)
TWD6,604.50
(含稅)
庫存資訊目前無法存取 - 請稍後再回來查看
包 | 每包 | 每單位* |
|---|---|---|
| 1 + | TWD6,290.00 | TWD139.778 |
* 參考價格
- RS庫存編號:
- 679-214
- 製造零件編號:
- 5822030-4
- 製造商:
- TE Connectivity
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | TE Connectivity | |
| Product Type | Memory Socket | |
| Memory Socket Type | Memory Card | |
| Insertion/Removal Method | Cam-In | |
| Orientation | Vertical | |
| Contact Material | Phosphor Bronze | |
| Current | 1A | |
| Contact Plating | Tin | |
| Number of Contacts | 80 | |
| Pitch | 1.27mm | |
| Mount Type | Board | |
| Housing Material | Liquid Crystal Polyester | |
| Termination Type | Through-Hole Solder Pin | |
| Latching | Yes | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | UL 94V-0 | |
| Series | MICRO-EDGE | |
| Voltage | 0.6kV | |
| 選取全部 | ||
|---|---|---|
品牌 TE Connectivity | ||
Product Type Memory Socket | ||
Memory Socket Type Memory Card | ||
Insertion/Removal Method Cam-In | ||
Orientation Vertical | ||
Contact Material Phosphor Bronze | ||
Current 1A | ||
Contact Plating Tin | ||
Number of Contacts 80 | ||
Pitch 1.27mm | ||
Mount Type Board | ||
Housing Material Liquid Crystal Polyester | ||
Termination Type Through-Hole Solder Pin | ||
Latching Yes | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals UL 94V-0 | ||
Series MICRO-EDGE | ||
Voltage 0.6kV | ||
- COO (Country of Origin):
- CN
The TE Connectivity SIMM Sockets are designed for vertical module orientation, offering a Compact and efficient Interface for memory module integration. With 80 positions and a robust operating temperature range from -55 to 105 °C [-67 to 221 °F], they ensure reliable performance in both standard and extreme environments. These sockets are Ideal for applications requiring secure and high-density memory connections.
Vertical module orientation for streamlined board layout
80 position configuration for high-capacity memory interfacing
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