The XLamp® XHP35.2 LeD is the next generation of extreme High Power LeDs available in the XP footprint. Built on Cree’s latest high-power LeD technology, the XHP35.2 LeD improves the voltage characteristics, efficacy and reliability of the XHP35 LED in the same 3.45 mm x 3.45 mm footprint. The new XHP35.2 LED provides an easy drop‑in upgrade so that lighting manufacturers can achieve higher system LPW on existing XHP35 designs with minimal system redesign cost.
Available in 5-step easyWhite® bins at 2700 K to 5700 K CCT and 3‑step EasyWhite bins at 2700 K to 3500 K CCT Available in ANSI white bins at 2700 K to 7000 K CCT Available in standard, 70‑, 80‑, 85‑ and 90‑minimum CRI options Binned at 85 °C Maximum drive current: 1050 mA Low thermal resistance: 1.8 °C/W Wide viewing angle: 135° Unlimited floor life at ≤ 30 ºC/85% RH
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