AAVID THERMALLOY Heatsink, Thin Components, Power Semiconductors, Sensors, 0.93°C/W 85.5 mm 150 mm 49.5 mm
- RS庫存編號:
- 712-4352
- 製造零件編號:
- 0SA36/50/B
- 製造商:
- AAVID THERMALLOY
此圖片僅供參考，請參閲產品詳細資訊及規格
小計（1 件）*
TWD498.00
(不含稅)
TWD522.90
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2027年1月28日 發貨
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單位 | 每單位 |
|---|---|
| 1 + | TWD498.00 |
* 參考價格
- RS庫存編號:
- 712-4352
- 製造零件編號:
- 0SA36/50/B
- 製造商:
- AAVID THERMALLOY
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | AAVID THERMALLOY | |
| Product Type | Heatsink | |
| For Use With | Thin Components, Power Semiconductors, Sensors | |
| Length | 150mm | |
| Width | 49.5 mm | |
| Height | 85.5mm | |
| Fastening | Clip | |
| Thermal Resistance | 0.93°C/W | |
| Colour | Black Anodised | |
| Finish | Black Anodised, Nickel Plated | |
| Compatible Package Type | TO-0247, TO-0247J, TO-0218, TO-0220, TO-220, TO-247 | |
| Standards/Approvals | U.S. Patent 5.991.151 | |
| Material | Nickel Plated, Special Spring Steel | |
| Application | Cooling | |
| Special Features | Easy to Assemble/Disassemble, Low Stress, Constant Pressure, High Corrosion Resistance, High Force Versions (H), High Elasticity | |
| 選取全部 | ||
|---|---|---|
品牌 AAVID THERMALLOY | ||
Product Type Heatsink | ||
For Use With Thin Components, Power Semiconductors, Sensors | ||
Length 150mm | ||
Width 49.5 mm | ||
Height 85.5mm | ||
Fastening Clip | ||
Thermal Resistance 0.93°C/W | ||
Colour Black Anodised | ||
Finish Black Anodised, Nickel Plated | ||
Compatible Package Type TO-0247, TO-0247J, TO-0218, TO-0220, TO-220, TO-247 | ||
Standards/Approvals U.S. Patent 5.991.151 | ||
Material Nickel Plated, Special Spring Steel | ||
Application Cooling | ||
Special Features Easy to Assemble/Disassemble, Low Stress, Constant Pressure, High Corrosion Resistance, High Force Versions (H), High Elasticity | ||
The Max Clip System™ OSA36 Profile
Clip mounting technology offers high reliability
Economic and manufacturing benefits that replace rivets and screws
Simplified and rapid assembly for mounting a semiconductor to the heatsink
Improved performance with the use of special thermal interface materials
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