Fischer Elektronik Heatsink, Universal Square Alu 14 mm 14 mm 14 mm
- RS庫存編號:
- 674-4740
- 製造零件編號:
- ICK PGA 6x6x14
- 製造商:
- Fischer Elektronik
小計（1 件）*
TWD83.00
(不含稅)
TWD87.15
(含稅)
訂單超過 $1,300.00 免費送貨
- 加上 285 件從 2026年2月23日 起發貨
單位 | 每單位 |
|---|---|
| 1 - 49 | TWD83.00 |
| 50 - 99 | TWD81.00 |
| 100 - 249 | TWD79.00 |
| 250 + | TWD76.00 |
* 參考價格
- RS庫存編號:
- 674-4740
- 製造零件編號:
- ICK PGA 6x6x14
- 製造商:
- Fischer Elektronik
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Fischer Elektronik | |
| For Use With | Universal Square Alu | |
| Product Type | Heatsink | |
| Length | 14mm | |
| Width | 14 mm | |
| Height | 14mm | |
| Fastening | Conductive Foil | |
| Colour | Black | |
| Finish | Black Anodised | |
| Compatible Package Type | IC, BGA, LED, Slot, SMD, PGA | |
| Standards/Approvals | No | |
| Material | Aluminium | |
| Application | Heat Sink For Bga, Cooler, SMD, Fan, PGA, Microprocessor, Pentium, Semiconductor | |
| Special Features | Fan Motors Also Available With Other Operating Voltages and Pulse Output/alarm Device Circuit, Particularly Suited for Ball Grid Arrays, High Mechanical Stability, Long Product Life, Optimised Geometry for Low Weight, Other Pin Lengths and Surfaces on Request, Can Be Glued Directly on BGA Component, Heat Sink Dimensions Match Respective BGA Type, Effective Heat Dissipation, Custom Modifications and Special Designs, Excellent Thermal Conductivity, Low Current Consumption, High Reliability | |
| 選取全部 | ||
|---|---|---|
品牌 Fischer Elektronik | ||
For Use With Universal Square Alu | ||
Product Type Heatsink | ||
Length 14mm | ||
Width 14 mm | ||
Height 14mm | ||
Fastening Conductive Foil | ||
Colour Black | ||
Finish Black Anodised | ||
Compatible Package Type IC, BGA, LED, Slot, SMD, PGA | ||
Standards/Approvals No | ||
Material Aluminium | ||
Application Heat Sink For Bga, Cooler, SMD, Fan, PGA, Microprocessor, Pentium, Semiconductor | ||
Special Features Fan Motors Also Available With Other Operating Voltages and Pulse Output/alarm Device Circuit, Particularly Suited for Ball Grid Arrays, High Mechanical Stability, Long Product Life, Optimised Geometry for Low Weight, Other Pin Lengths and Surfaces on Request, Can Be Glued Directly on BGA Component, Heat Sink Dimensions Match Respective BGA Type, Effective Heat Dissipation, Custom Modifications and Special Designs, Excellent Thermal Conductivity, Low Current Consumption, High Reliability | ||
- COO (Country of Origin):
- DE
ICK PGA Series
PGA Heatsinks
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