Transcend M.2 128 GB Internal SSD

小計(1 件)*

TWD5,632.00

(不含稅)

TWD5,913.60

(含稅)

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  • 2026年10月14日 發貨
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RS庫存編號:
683-190
製造零件編號:
TS128GMTS560T-VS1
製造商:
Transcend
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品牌

Transcend

Memory Size

128GB

Sub Type

SSD

Product Type

SSD

Internal/External

Internal

Industrial Grade

Yes

Form Factor

M.2

NAND Type

3D

Interface Type

SATA III 6 Gb/S

Minimum Operating Temperature

-20°C

Maximum Operating Temperature

75°C

Height

3.58mm

Width

22mm

Standards/Approvals

UKCA

Length

42mm

COO (Country of Origin):
TW

Transcend SSD, 128GB Storage Capacity, M.2 Form Factor - TS128GMTS560T-VS1


This M.2 form-factor solid-state drive is intended for internal storage in embedded and industrial systems, delivering non-volatile flash memory in a Compact package. It connects via a SATA III 6Gb/s Interface and is designed to operate across a broad temperature range for use in equipment requiring Durable storage. The device uses 3D NAND memory and carries UKCA conformity for deployment in regulated environments.

Features and Benefits:


• 128GB capacity providing substantial local data storage
• SATA III 6Gb/s Interface enabling sustained host transfer rates
• Industrial-grade construction supporting rigorous duty cycles
• Operates at temperatures down to -20°C for cold environments
• Rated to 75°C maximum operating temperature for high-heat sites
• Slim 3.58mm profile allowing installation in space-constrained systems

Applications


• Suitable for industrial controllers in automation lines
• Ideal for embedded computing in electrical test equipment
• Used with Compact IoT gateways requiring internal storage
• Can be used for data logging in mechanical monitoring systems
• Suitable for firmware and OS storage in industrial PCs

What physical format should I expect for board-level fitting?


The drive follows the M.2 2242 board geometry with a 42mm length and 22mm width for direct socket mounting.

How does the drive cope with high ambient temperatures in enclosures?


It is specified to function at continuous operating temperatures up to 75°C, enabling use inside warm cabinets or close to heat-generating components.

What type of flash memory cells are used and what is the storage principle?


The device employs stacked 3D NAND architecture, which increases cell density by layering memory planes vertically while providing non-volatile data retention.

Is the unit intended for removable external use or permanent internal installation?


It is designed as an internal storage module for integration into host systems rather than as an external removable device.

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