Transcend M.2 512 GB Internal SSD

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RS庫存編號:
683-169
製造零件編號:
TS512GMTE712AI-VS1
製造商:
Transcend
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品牌

Transcend

Memory Size

512GB

Sub Type

SSD

Product Type

SSD

Internal/External

Internal

Form Factor

M.2

Industrial Grade

Yes

NAND Type

3D

Interface Type

NVMe PCIe Gen 4 x4

Encryption Level

256 Bit AES Encryption

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

85°C

Width

22mm

Length

80mm

Standards/Approvals

UKCA

Height

3.58mm

Transcend SSD, 512GB Storage Capacity, M.2 Form Factor - TS512GMTE712AI-VS1


This SSD provides high-speed internal storage for industrial and professional systems, designed to operate in demanding temperature ranges and to integrate with modern host Interfaces. It connects via an NVMe PCIe Gen4 x4 Interface in an M.2 form and is intended for use where compact, secure, and robust non-volatile memory is required.

Features and Benefits:


• 512GB capacity enables substantial on-board data retention and caching
• 256-bit AES encryption protects stored data at rest
• 3D NAND delivers dense flash storage with solid endurance
• NVMe PCIe Gen4 x4 Interface offers high-throughput I/O performance
• Industrial-grade construction supports harsh deployment environments
• UKCA approval meets regional regulatory recognition for equipment

Applications


• Suitable for industrial automation controllers requiring secure storage
• Ideal for embedded electronics in test and measurement rigs
• Used with ruggedised desktops for field engineering data logging
• Can be used for firmware storage in electrical control panels

What physical format does it use and how Compact is it?


It uses the M.2 form factor in the 80mm length and 22mm width footprint common to 2280 modules, enabling low-profile integration into constrained equipment bays.

Which temperature extremes can it tolerate during operation?


The device is specified to function at ambient temperatures from -40°C up to 85°C, supporting deployment in cold-start and elevated-heat environments.

What type of flash memory technology is implemented?


The drive uses 3D NAND architecture, providing stacked memory cells for improved storage density.

Is it intended for internal or external installation?


The unit is designed for internal installation into host systems via its M.2 connector.

What clearance or mounting height should designers allow for?


The module has a low-profile height of 3.58 mm, facilitating installation where vertical space is limited.

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