Transcend M.2 2 TB Internal SSD

RS庫存編號:: 683-006
製造零件編號:: TS2TMTE760T
製造商:: Transcend

小計（1 件）*

TWD69,702.00

(不含稅)

TWD73,187.10

訂單超過 $1,300.00 免費送貨

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RS庫存編號:: 683-006
製造零件編號:: TS2TMTE760T
製造商:: Transcend

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選取全部	屬性	值
	品牌	Transcend
	Memory Size	2TB
	Sub Type	SSD
	Product Type	SSD
	Internal/External	Internal
	Industrial Grade	Yes
	Form Factor	M.2
	NAND Type	3D
	Encryption Level	256 Bit AES Encryption
	Interface Type	NVMe PCIe Gen 4 x4
	Maximum Operating Temperature	75°C
	Minimum Operating Temperature	-20°C
	Height	2.23mm
	Width	22mm
	Length	80mm
	Standards/Approvals	UKCA

	選取全部
	品牌 Transcend
	Memory Size 2TB
	Sub Type SSD
	Product Type SSD
	Internal/External Internal
	Industrial Grade Yes
	Form Factor M.2
	NAND Type 3D
	Encryption Level 256 Bit AES Encryption
	Interface Type NVMe PCIe Gen 4 x4
	Maximum Operating Temperature 75°C
	Minimum Operating Temperature -20°C
	Height 2.23mm
	Width 22mm
	Length 80mm
	Standards/Approvals UKCA

Datasheet - TS2TMTE760T

COO (Country of Origin):: TW

Transcend SSD, 2TB Memory size, NVMe PCIe Gen 4 x4 Interface Type - TS2TMTE760T

This SSD is an internal storage device designed for high-performance NVMe applications in industrial settings. It connects via a PCIe Gen4 x4 Interface in an M.2 form factor and is intended for use where compact, high-capacity flash storage is required under demanding environmental conditions.

Features and Benefits:

• 2TB capacity enables large dataset and image storage
• NVMe PCIe Gen4 x4 provides high-throughput transfer rates
• 3D NAND offers increased storage density for longevity
• 256-bit AES encryption secures stored data at rest
• Industrial-grade design tolerates extreme operational stress
• Operating range from -20°C to 75°C supports harsh environments

Applications

• Suitable for embedded automation controllers requiring local mass storage
• Ideal for data logging in electrical test rigs and instrumentation
• Used with industrial PCs in manufacturing process control
• Can be used for onboard storage in robotics and motion systems
• Suitable for edge computing in remote monitoring installations

What physical footprint does it occupy for board layout planning?

It uses the M.2 2280 footprint with a width of 22mm and a length of 80 mm, enabling Compact placement on compatible carrier boards.

How does it handle elevated junction temperatures during sustained workloads?

The device is rated to operate up to a maximum temperature of 75°C, supporting continuous operation in thermally challenging locations.

Is it suitable for integration into sealed electrical enclosures?

Yes, its industrial grading and temperature tolerance make it appropriate for enclosed equipment where ambient conditions can vary.

Which NAND architecture is employed and what is the impact on endurance?

It uses 3D NAND, which increases cell stacking for higher density and contributes to improved programme/erase endurance profiles compared with Planar NAND.