Transcend TS1TMTE370T 2230-S3-M 1 TB Internal SSD
- RS庫存編號:
- 175-421
- 製造零件編號:
- TS1TMTE370T
- 製造商:
- Transcend
供應短缺
由於全球供應短缺,我們不知道何時會到貨。
- RS庫存編號:
- 175-421
- 製造零件編號:
- TS1TMTE370T
- 製造商:
- Transcend
規格
產品概覽和技術數據資料表
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產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Transcend | |
| Sub Type | SSD | |
| Product Type | SSD | |
| Memory Size | 1TB | |
| Model Number | TS1TMTE370T | |
| Internal/External | Internal | |
| Industrial Grade | Yes | |
| Form Factor | 2230-S3-M | |
| NAND Type | 3D TLC | |
| Encryption Level | AES | |
| Interface Type | PCIe Gen 3.0 x4 NVMe | |
| Minimum Operating Temperature | -20°C | |
| Maximum Operating Temperature | 75°C | |
| Width | 22mm | |
| Length | 30mm | |
| Height | 2.38mm | |
| Standards/Approvals | BSMI, CE, FCC, RoHS, UKCA | |
| 選取全部 | ||
|---|---|---|
品牌 Transcend | ||
Sub Type SSD | ||
Product Type SSD | ||
Memory Size 1TB | ||
Model Number TS1TMTE370T | ||
Internal/External Internal | ||
Industrial Grade Yes | ||
Form Factor 2230-S3-M | ||
NAND Type 3D TLC | ||
Encryption Level AES | ||
Interface Type PCIe Gen 3.0 x4 NVMe | ||
Minimum Operating Temperature -20°C | ||
Maximum Operating Temperature 75°C | ||
Width 22mm | ||
Length 30mm | ||
Height 2.38mm | ||
Standards/Approvals BSMI, CE, FCC, RoHS, UKCA | ||
- COO (Country of Origin):
- TW
Transcend SSD, 1TB Memory Size, PCIe Gen 3.0 x4 NVMe Interface Type - TS1TMTE370T
This SSD is an internal NVMe storage device designed for embedded and industrial environments, delivering high-capacity solid-state storage over a PCIe Gen3 x4 link. It operates across a broad temperature range and implements hardware-level encryption to protect stored data while fitting Compact system designs.
Features and Benefits:
• 1TB capacity provides large local data storage
• PCIe Gen3 x4 Interface enables high-throughput transfers
• 3D TLC NAND offers balanced endurance and density
• AES hardware encryption secures stored information
• Industrial-grade design supports prolonged field use
• Conforms to RoHS, CE, FCC and UKCA regulatory standards
• PCIe Gen3 x4 Interface enables high-throughput transfers
• 3D TLC NAND offers balanced endurance and density
• AES hardware encryption secures stored information
• Industrial-grade design supports prolonged field use
• Conforms to RoHS, CE, FCC and UKCA regulatory standards
Applications
• Suitable for industrial embedded controllers requiring local storage
• Ideal for IoT gateways with limited internal space
• Used with automotive and transport data-logging systems
• Can be used for edge compute nodes in harsh climates
• Useful for secure on-device data retention in appliances
• Ideal for IoT gateways with limited internal space
• Used with automotive and transport data-logging systems
• Can be used for edge compute nodes in harsh climates
• Useful for secure on-device data retention in appliances
What temperature extremes can it tolerate in operation?
It functions across an operating range from -20°C to 75°C, supporting deployment in hot and cold environments.
What form factor is required for installation in Compact systems?
The drive uses the 2230-S3-M form factor, compatible with systems accepting 2230 M.2 modules.
Which NAND technology does the device use and why does that matter?
It employs 3D TLC memory, which provides a balance between storage density and write endurance suited to many industrial workloads.
What connectivity standard must a host support for full performance?
The host must provide a PCIe Gen3 x4 NVMe Interface to achieve the intended data throughput.
Which certifications indicate suitability for regulated markets?
The unit holds BSMI, CE, FCC and RoHS approvals along with UKCA marking for applicable jurisdictions.
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