Infineon NOR 256 MB SPI FL-S Flash 16-Pin WSON, S25FL256SAGMFI003

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RS庫存編號:
273-5390
製造零件編號:
S25FL256SAGMFI003
製造商:
Infineon
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品牌

Infineon

Memory Size

256MB

Product Type

FL-S Flash

Interface Type

SPI

Package Type

WSON

Pin Count

16

Organisation

32MB

Maximum Clock Frequency

133MHz

Cell Type

NOR

Minimum Supply Voltage

2.7V

Maximum Supply Voltage

3.6V

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

+85°C

Standards/Approvals

RoHS

Supply Current

100mA

Series

S25FL

Automotive Standard

AEC-Q100

COO (Country of Origin):
US

Infineon S25FL Series FL-S Flash, 256MB Memory Size, 2.7V Minimum Supply Voltage - S25FL256SAGMFI003


This fl-s flash is a high-capacity SPI NOR device designed for embedded systems requiring non-volatile storage across extended temperature ranges. It operates from low to elevated ambient conditions and interfaces via SPI to deliver fast read/write access for firmware, boot code and data logging in industrial and automotive contexts. The device is supplied in a Compact WSON package suitable for space-constrained boards and meets environmental restrictions for electronic components.

Features and Benefits:


• 133MHz clock supporting fast serial data transfers
• 2.7V to 3.6V range enabling flexible power-rail integration
• -40°C to +85°C rating permitting operation in harsh environments
• 100mA supply current allowing predictable power budgeting
• 16-pin WSON package minimising PCB footprint

Applications


• Suitable for automotive control unit firmware storage
• Ideal for industrial data-logging devices and gateways
• Used with gateway modules requiring Compact memory
• Can be used for boot code in embedded controllers
• Suitable for instrumentation operating across wide temperatures

What Interface does it use for communication?


It communicates over a serial peripheral Interface capable of high-speed SPI signalling.

Which package type should PCB designers expect for placement?


The component is supplied in a WSON package with a 16-pin footprint for surface-mount assembly.

What semiconductor cell architecture is implemented for non-volatile storage?


It uses NOR-type cells suitable for Execute-In-Place and direct code execution.

Is there an automotive qualification relevant to design-in?


It complies with the AEC-Q100 automotive standard applicable to semiconductor components.

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