Alliance Memory NAND 5 GB Flash Memory FBGA, ASFC5G31P3-51BIN

小計(1 托盤,共 1520 件)*

TWD595,992.00

(不含稅)

TWD625,784.00

(含稅)

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  • 2026年3月23日 發貨
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1520 +TWD392.10TWD595,992.00

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RS庫存編號:
338-521
製造零件編號:
ASFC5G31P3-51BIN
製造商:
Alliance Memory
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品牌

Alliance Memory

Memory Size

5GB

Product Type

Flash Memory

Package Type

FBGA

Maximum Clock Frequency

200MHz

Cell Type

NAND

Maximum Supply Voltage

3.6V

Minimum Supply Voltage

2.7V

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

85°C

Length

13mm

Width

11.5 mm

Standards/Approvals

RoHS Compliant

Height

1mm

Automotive Standard

No

Supply Current

132mA

Series

ASFC 3D pSLC

COO (Country of Origin):
DE
The Alliance Memory e-MMC is a managed non-volatile storage consisting of a single chip MMC controller and a NAND flash memory chip inside a JEDEC defined standard BGA package. It is specially designed as a small form factor memory product for storage of data and as a boot media. The performance is optimized to a mostly read operation mode at low power consumption. The utilization of 3D pSLC NAND technology targets higher demanding and write intensive industrial applications, which is supported by the industrial temperature grade specification. The e-MMC controller directly manages NAND flash, including ECC, wear-leveling, IOPS optimization and read sensing. The 3D PSLC firmware features support high throughput for large data transfers and performance for small random data more commonly found in code usage. It also contains several security features as well as multiple boot partitions. Uses advanced refresh features for retention optimization for read intensive applications.

Capacities 5G

Fully compliant with JEDEC eMMC 5.1 Standard JESD84-B51

153-ball BGA 0.5mm pitch 11.5 x 13mm RoHS compliant

3D TLC NAND base technology in Enhanced Mode pSLC

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