Microchip 24CS256T-I/SN, 256 kB EEPROM, 5 ms 8-Pin SOIC 2 Wire I2C
- RS庫存編號:
- 734-428
- 製造零件編號:
- 24CS256T-I/SN
- 製造商:
- Microchip
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此圖片僅供參考，請參閲產品詳細資訊及規格
小計（1 卷，共 3300 件）*
TWD60,390.00
(不含稅)
TWD63,426.00
(含稅)
庫存資訊目前無法存取 - 請稍後再回來查看
單位 | 每單位 | 每卷* |
|---|---|---|
| 3300 + | TWD18.30 | TWD60,390.00 |
* 參考價格
- RS庫存編號:
- 734-428
- 製造零件編號:
- 24CS256T-I/SN
- 製造商:
- Microchip
規格
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法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Microchip | |
| Product Type | EEPROM | |
| Memory Size | 256kB | |
| Interface Type | 2 Wire I2C | |
| Package Type | SOIC | |
| Mount Type | Surface Mount | |
| Pin Count | 8 | |
| Maximum Clock Frequency | 3.4MHz | |
| Minimum Supply Voltage | 1.7V | |
| Maximum Supply Voltage | 5.5V | |
| Number of Bits per Word | 8 | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Series | 24CS | |
| Standards/Approvals | RoHS | |
| Data Retention | 200year | |
| Automotive Standard | No | |
| Supply Current | 1μA | |
| Maximum Random Access Time | 5ms | |
| Number of Words | 32768 | |
| 選取全部 | ||
|---|---|---|
品牌 Microchip | ||
Product Type EEPROM | ||
Memory Size 256kB | ||
Interface Type 2 Wire I2C | ||
Package Type SOIC | ||
Mount Type Surface Mount | ||
Pin Count 8 | ||
Maximum Clock Frequency 3.4MHz | ||
Minimum Supply Voltage 1.7V | ||
Maximum Supply Voltage 5.5V | ||
Number of Bits per Word 8 | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Series 24CS | ||
Standards/Approvals RoHS | ||
Data Retention 200year | ||
Automotive Standard No | ||
Supply Current 1μA | ||
Maximum Random Access Time 5ms | ||
Number of Words 32768 | ||
- COO (Country of Origin):
- TH
The Microchip EEPROM is a high-density memory solution designed for reliable data storage. Its primary function is to provide efficient access and retention of large data sets in Compact environments.
Offers a 256K bit organisation for versatile data management
Ensures fast read and write speeds to maximise performance
Supports a wide voltage range to enhance compatibility
Features SOIC packaging for efficient space utilisation
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