Winslow 2.54 mm Pitch Vertical 32 Way, Through Hole Turned Pin Open Frame DIL Socket, 3A
- RS庫存編號:
- 226-3922
- 製造零件編號:
- W30532SFTRC
- 製造商:
- Winslow
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
小計（1 管，共 12 件）*
TWD838.80
(不含稅)
TWD880.80
(含稅)
訂單超過 $1,300.00 免費送貨
有庫存
- 加上 156 件從 2026年2月23日 起發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每管* |
|---|---|---|
| 12 - 588 | TWD69.90 | TWD838.80 |
| 600 - 2988 | TWD67.30 | TWD807.60 |
| 3000 + | TWD64.30 | TWD771.60 |
* 參考價格
- RS庫存編號:
- 226-3922
- 製造零件編號:
- W30532SFTRC
- 製造商:
- Winslow
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Winslow | |
| Product Type | DIL Socket | |
| Number of Contacts | 32 | |
| Mount Type | Through Hole | |
| Pin Type | Turned | |
| Current | 3A | |
| Pitch | 2.54mm | |
| Row Width | 15.24mm | |
| Frame Type | Open Frame | |
| Contact Plating | Tin, Gold | |
| Orientation | Vertical | |
| Minimum Operating Temperature | -65°C | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 150°C | |
| Standards/Approvals | No | |
| Width | 3.5 mm | |
| Depth | 17.66mm | |
| Length | 40.56mm | |
| Housing Material | Polybutylene Terephthalate | |
| Contact Material | Beryllium Copper Alloy | |
| 選取全部 | ||
|---|---|---|
品牌 Winslow | ||
Product Type DIL Socket | ||
Number of Contacts 32 | ||
Mount Type Through Hole | ||
Pin Type Turned | ||
Current 3A | ||
Pitch 2.54mm | ||
Row Width 15.24mm | ||
Frame Type Open Frame | ||
Contact Plating Tin, Gold | ||
Orientation Vertical | ||
Minimum Operating Temperature -65°C | ||
Termination Type Solder | ||
Maximum Operating Temperature 150°C | ||
Standards/Approvals No | ||
Width 3.5 mm | ||
Depth 17.66mm | ||
Length 40.56mm | ||
Housing Material Polybutylene Terephthalate | ||
Contact Material Beryllium Copper Alloy | ||
- COO (Country of Origin):
- GB
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).
相關連結
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