TE Connectivity AMPLIMITE 0.50 Series Thermoplastic D Sub Backshell, 100 Way

可享批量折扣

小計(1 袋,共 100 件)*

TWD78,150.00

(不含稅)

TWD82,058.00

(含稅)

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  • 2026年6月26日 發貨
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單位
每單位
每袋*
100 - 400TWD781.50TWD78,150.00
500 +TWD758.10TWD75,810.00

* 參考價格

RS庫存編號:
189-5811
製造零件編號:
5749081-1
製造商:
TE Connectivity
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品牌

TE Connectivity

Number of Contacts

100

Housing Material

Thermoplastic

Series

AMPLIMITE 0.50

不適用

Our reliable AMPLIMITE D-sub .050 series connector portfolio offers a high density D type interface and includes right angle and vertical D-subs. Both versions have three mating faces available, flat face, latch block and latch block with rails. Plug and receptacle positions include 20, 26, 28, 40, 50, 68, 80, 100 and 120 (ACTION PIN only). AMPLIMITE .050 Series connectors utilize gold plated tab and tuning fork contacts on a compact .050 x .100 grid spacing and are available with 20 to 100 positions. The AMPLIMITE .050 series cable connectors terminate to wire via the insulation displacement contact (IDC) termination method, which provides fast, reliable and economical termination of discrete wire or ribbon cable. Both solder, and compliant pin terminations are offered on the printer circuit board versions. All connectors are produced with metal shell construction, which provides EMI/ RFI shielding capability and high durability.

High density D type interface
20 through 100 contact positions
Excellent EMI/RFI protection
Protect your system with shields that mate before contacts, with ground mating first and breaking last
Squeeze-to-release latches or jackscrew hardware available to fit your needs
Board connectors compatible with standard thru-hole flow solder and surface-mount reflow solder processes
Applications
Industrial machinery
Medical instrumentation
Computers and peripherals
RAID storage arrays
File servers/routers
Tape storage systems
Workstations
On-machine industrial communications
Personal and handheld devices

For these non-cancellable (NC), and non-returnable (NR) products, Terms and Conditions apply.


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