Renesas Electronics 2305NZ-1HDCG8 Clock Buffer 8-Pin SOIC
- RS庫存編號:
- 264-1282
- 製造零件編號:
- 2305NZ-1HDCG8
- 製造商:
- Renesas Electronics
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
小計（1 包，共 5 件）*
TWD205.00
(不含稅)
TWD215.25
(含稅)
訂單超過 $1,300.00 免費送貨
庫存資訊目前無法查詢
單位 | 每單位 | 每包* |
|---|---|---|
| 5 - 45 | TWD41.00 | TWD205.00 |
| 50 - 95 | TWD40.40 | TWD202.00 |
| 100 - 245 | TWD39.40 | TWD197.00 |
| 250 - 995 | TWD38.80 | TWD194.00 |
| 1000 + | TWD38.20 | TWD191.00 |
* 參考價格
- RS庫存編號:
- 264-1282
- 製造零件編號:
- 2305NZ-1HDCG8
- 製造商:
- Renesas Electronics
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Renesas Electronics | |
| Product Type | Clock Buffer | |
| Maximum Input Frequency | 133.33MHz | |
| Maximum Propagation Delay Time | 8.7ns | |
| Mount Type | Surface | |
| Package Type | SOIC | |
| Pin Count | 8 | |
| Number of Outputs | 5 | |
| Minimum Supply Voltage | 3V | |
| Maximum Supply Voltage | 3.6V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 70°C | |
| Height | 1.55mm | |
| Length | 5mm | |
| Width | 6.3 mm | |
| Standards/Approvals | RoHS | |
| Series | IDT2305NZ | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 Renesas Electronics | ||
Product Type Clock Buffer | ||
Maximum Input Frequency 133.33MHz | ||
Maximum Propagation Delay Time 8.7ns | ||
Mount Type Surface | ||
Package Type SOIC | ||
Pin Count 8 | ||
Number of Outputs 5 | ||
Minimum Supply Voltage 3V | ||
Maximum Supply Voltage 3.6V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 70°C | ||
Height 1.55mm | ||
Length 5mm | ||
Width 6.3 mm | ||
Standards/Approvals RoHS | ||
Series IDT2305NZ | ||
Automotive Standard No | ||
- COO (Country of Origin):
- PH
The Renesas Electronics low-cost buffer designed to distribute high-speed clocks in mobile PC systems and desktop PC systems. The IDT2305NZ operates at 3.3V with five outputs that can run up to 133.33 MHz. It is designed for low EMI and power optimization and consumes less than 32 mA at 66.6 MHz, making it ideal for the low power requirements of mobile systems.
High drive capability
Available in SOIC package
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