STMicroelectronics Surface Mount Chip Balun

The BAL-UWB-01E3 is an ultra-miniature balun that integrates matching network, dedicated to ultra-wide band 3 GHz to 8 Ghz. This device uses STMicroelectronics IPD technology on non conductive glass substrate which optimizes RF performance.

Very low profile
High RF performance
PCB space saving
Efficient manufacturability
LGA footprint compatible
Low thickness ≤ 450 μm

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