Nexperia BC856AQCZ Bipolar Transistor, -100 mA PNP, -65 V, 3-Pin SOT-8009
- RS庫存編號:
- 240-1803
- 製造零件編號:
- BC856AQCZ
- 製造商:
- Nexperia
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
小計（1 包，共 50 件）*
TWD145.00
(不含稅)
TWD152.00
(含稅)
訂單超過 $1,300.00 免費送貨
有庫存
- 加上 5,000 件從 2026年5月04日 起發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每包* |
|---|---|---|
| 50 - 50 | TWD2.90 | TWD145.00 |
| 100 - 450 | TWD2.80 | TWD140.00 |
| 500 - 950 | TWD2.80 | TWD140.00 |
| 1000 - 2450 | TWD2.70 | TWD135.00 |
| 2500 + | TWD2.70 | TWD135.00 |
* 參考價格
- RS庫存編號:
- 240-1803
- 製造零件編號:
- BC856AQCZ
- 製造商:
- Nexperia
規格
產品概覽和技術數據資料表
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Nexperia | |
| Product Type | Bipolar Transistor | |
| Maximum DC Collector Current Idc | -100mA | |
| Maximum Collector Emitter Voltage Vceo | -65V | |
| Package Type | SOT-8009 | |
| Mount Type | Surface | |
| Transistor Configuration | PNP | |
| Maximum Collector Base Voltage VCBO | -80V | |
| Transistor Polarity | PNP | |
| Minimum DC Current Gain hFE | 125 | |
| Minimum Operating Temperature | -55°C | |
| Maximum Emitter Base Voltage VEBO | -6V | |
| Pin Count | 3 | |
| Maximum Operating Temperature | 150°C | |
| Series | BC856xQC | |
| Standards/Approvals | RoHS | |
| Automotive Standard | AEC-Q101 | |
| 選取全部 | ||
|---|---|---|
品牌 Nexperia | ||
Product Type Bipolar Transistor | ||
Maximum DC Collector Current Idc -100mA | ||
Maximum Collector Emitter Voltage Vceo -65V | ||
Package Type SOT-8009 | ||
Mount Type Surface | ||
Transistor Configuration PNP | ||
Maximum Collector Base Voltage VCBO -80V | ||
Transistor Polarity PNP | ||
Minimum DC Current Gain hFE 125 | ||
Minimum Operating Temperature -55°C | ||
Maximum Emitter Base Voltage VEBO -6V | ||
Pin Count 3 | ||
Maximum Operating Temperature 150°C | ||
Series BC856xQC | ||
Standards/Approvals RoHS | ||
Automotive Standard AEC-Q101 | ||
The Nexperia PNP general-purpose transistor in an ultra small DFN1412D-3 (SOT8009) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.
High power dissipation capability
Suitable for Automatic Optical Inspection (AOI) of solder joint
Smaller footprint compared to conventional leaded SMD packages
Low package height of 0.5 mm
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