onsemi FJP3305H1TU Transistor, 4 A NPN, 400 V, 3-Pin TO-220
- RS庫存編號:
- 145-4545
- 製造零件編號:
- FJP3305H1TU
- 製造商:
- onsemi
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
小計（1 管，共 50 件）*
TWD1,445.00
(不含稅)
TWD1,517.00
(含稅)
訂單超過 $1,300.00 免費送貨
最後的 RS 庫存
- 最終 150 個，準備發貨
單位 | 每單位 | 每管* |
|---|---|---|
| 50 - 200 | TWD28.90 | TWD1,445.00 |
| 250 + | TWD26.00 | TWD1,300.00 |
* 參考價格
- RS庫存編號:
- 145-4545
- 製造零件編號:
- FJP3305H1TU
- 製造商:
- onsemi
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | onsemi | |
| Product Type | Transistor | |
| Maximum DC Collector Current Idc | 4A | |
| Maximum Collector Emitter Voltage Vceo | 400V | |
| Package Type | TO-220 | |
| Mount Type | Through Hole | |
| Transistor Configuration | Single | |
| Maximum Collector Base Voltage VCBO | 700V | |
| Maximum Transition Frequency ft | 4MHz | |
| Transistor Polarity | NPN | |
| Minimum DC Current Gain hFE | 8 | |
| Maximum Power Dissipation Pd | 75W | |
| Maximum Emitter Base Voltage VEBO | 9V | |
| Maximum Operating Temperature | 150°C | |
| Pin Count | 3 | |
| Length | 10.67mm | |
| Height | 16.51mm | |
| Series | FJP3305 | |
| Standards/Approvals | No | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 onsemi | ||
Product Type Transistor | ||
Maximum DC Collector Current Idc 4A | ||
Maximum Collector Emitter Voltage Vceo 400V | ||
Package Type TO-220 | ||
Mount Type Through Hole | ||
Transistor Configuration Single | ||
Maximum Collector Base Voltage VCBO 700V | ||
Maximum Transition Frequency ft 4MHz | ||
Transistor Polarity NPN | ||
Minimum DC Current Gain hFE 8 | ||
Maximum Power Dissipation Pd 75W | ||
Maximum Emitter Base Voltage VEBO 9V | ||
Maximum Operating Temperature 150°C | ||
Pin Count 3 | ||
Length 10.67mm | ||
Height 16.51mm | ||
Series FJP3305 | ||
Standards/Approvals No | ||
Automotive Standard No | ||
High Voltage NPN Transistors, Fairchild Semiconductor
Bipolar Transistors, Fairchild Semiconductor
Bipolar Junction Transistors (BJT) broad range provides complete solutions for various circuit application needs. Innovative packages are designed for minimal size, highest reliability and maximum thermal performance.
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