Molex, 76145 1.9 mm Pitch Backplane Connector, Vertical, 16 Column, 18 Row, 288 Way
- RS庫存編號:
- 694-254
- 製造零件編號:
- 76145-5617
- 製造商:
- Molex
可享批量折扣
查看批量定價選項小計（1 托盤，共 5 件）*
TWD7,721.00
(不含稅)
TWD8,107.05
(含稅)
訂單超過 $1,300.00 免費送貨
製造商存貨
- 準備從 2026年10月13日 起發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每托盤* |
|---|---|---|
| 5 - 20 | TWD1,544.20 | TWD7,721.00 |
| 25 + | TWD1,513.20 | TWD7,566.00 |
* 參考價格
- RS庫存編號:
- 694-254
- 製造零件編號:
- 76145-5617
- 製造商:
- Molex
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Product Type | Backplane Connector | |
| Number of Contacts | 288 | |
| Current | 0.75A | |
| Orientation | Vertical | |
| Number of Columns | 16 | |
| Number of Rows | 18 | |
| Voltage | 30V | |
| Housing Material | High Temperature Thermoplastic | |
| Pitch | 1.9mm | |
| Contact Material | High Performance Alloy | |
| Mount Type | Through Hole | |
| Contact Plating | Gold | |
| Termination Type | Press Fit | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | RoHS Compliant | |
| Series | 76145 | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Product Type Backplane Connector | ||
Number of Contacts 288 | ||
Current 0.75A | ||
Orientation Vertical | ||
Number of Columns 16 | ||
Number of Rows 18 | ||
Voltage 30V | ||
Housing Material High Temperature Thermoplastic | ||
Pitch 1.9mm | ||
Contact Material High Performance Alloy | ||
Mount Type Through Hole | ||
Contact Plating Gold | ||
Termination Type Press Fit | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals RoHS Compliant | ||
Series 76145 | ||
- COO (Country of Origin):
- SG
The Molex Impact 100 Ohm 6 Pair Vertical Backplane Header is engineered for optimal connectivity in high-density applications. Designed with precision, this header features an open endwall and right-guided configuration that delivers exceptional performance at data rates of up to 25.0 Gbps. With a robust construction that supports up to 288 circuits using high-performance alloy metal and a Durable resin, it ensures a reliable connection under varying conditions. The installation is straightforward with through-hole compliant pin terminations, making it an Ideal choice for versatile PCB designs, while its Compact 16-column layout enhances space efficiency in electronic systems.
Supports a high data rate of 25.0 Gbps for fast data transmission
Vertical orientation optimises space and fits within Compact electronic assemblies
Designed for up to 288 circuits, accommodating substantial data needs
Lead-free components promote environmental compatibility and compliance
Durability rated for 200 mating cycles, ensuring long-lasting connections
Black resin housing provides additional protection and aesthetic value
Plating materials of gold and tin enhance corrosion resistance and other performance attributes