Molex, 170335 1.9 mm Pitch Connector Backplane Connector, Vertical, 12 Column, 12 Row, 144 Way
- RS庫存編號:
- 684-011
- 製造零件編號:
- 170335-1227
- 製造商:
- Molex
小計（1 托盤，共 8 件）*
TWD8,306.00
(不含稅)
TWD8,721.30
(含稅)
訂單超過 $1,300.00 免費送貨
製造商存貨
- 準備從 2026年10月02日 起發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
托盤 | 每托盤 | 每單位* |
|---|---|---|
| 1 + | TWD8,306.00 | TWD1,038.25 |
* 參考價格
- RS庫存編號:
- 684-011
- 製造零件編號:
- 170335-1227
- 製造商:
- Molex
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Product Type | Backplane Connector | |
| Backplane Connector Type | Connector | |
| Current | 750mA | |
| Number of Contacts | 144 | |
| Orientation | Vertical | |
| Number of Columns | 12 | |
| Voltage | 30V | |
| Number of Rows | 12 | |
| Pitch | 1.9mm | |
| Contact Plating | Gold over Tin | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | RoHS, REACH | |
| Series | 170335 | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Product Type Backplane Connector | ||
Backplane Connector Type Connector | ||
Current 750mA | ||
Number of Contacts 144 | ||
Orientation Vertical | ||
Number of Columns 12 | ||
Voltage 30V | ||
Number of Rows 12 | ||
Pitch 1.9mm | ||
Contact Plating Gold over Tin | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals RoHS, REACH | ||
Series 170335 | ||
- COO (Country of Origin):
- SG
The Molex Impact 85 Ohm Plus 4 Pair Vertical Header designed to provide reliable connectivity in high-performance applications. With its dual end wall structure and 12 columns featuring 144 circuits, this PCB header excels in delivering precision connections in mezzanine and conventional applications. Enhanced durability is ensured with a mating cycle maximum of 200, allowing consistent performance in critical environments. This lead-free component operates within a temperature range of -55° to +85°C, making it suitable for a variety of industrial settings. Ideal for use in advanced electronics, it adheres to stringent environmental compliance standards, highlighting both its functionality and eco-friendliness.
Dual end wall design enhances stability and connectivity
Lead free materials contribute to environmental compliance
Finished with gold plating for optimal electrical conductivity
High temperature thermoplastic resin improves thermal resistance
Designed for through hole compliant pin termination for robustness
Suitable for high speed applications with a data rate of 25 Gbps