TE Connectivity, Z-PACK HM-Zd 2.5 mm Pitch High Speed Backplane Connector, Vertical Male, 10 Column, 6 Row, 60 Way
- RS庫存編號:
- 679-477
- 製造零件編號:
- 6469083-2
- 製造商:
- TE Connectivity
N
小計（1 管，共 20 件）*
TWD8,082.00
(不含稅)
TWD8,486.10
(含稅)
訂單超過 $1,300.00 免費送貨
製造商存貨
- 準備從 2026年7月02日 起發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
管 | 每管 | 每單位* |
|---|---|---|
| 1 + | TWD8,082.00 | TWD404.10 |
* 參考價格
- RS庫存編號:
- 679-477
- 製造零件編號:
- 6469083-2
- 製造商:
- TE Connectivity
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | TE Connectivity | |
| Product Type | Backplane Connector | |
| Backplane Connector Type | High Speed | |
| Number of Contacts | 60 | |
| Current | 0.7A | |
| Orientation | Vertical | |
| Number of Columns | 10 | |
| Connector Gender | Male | |
| Number of Rows | 6 | |
| Voltage | 250V | |
| Housing Material | Fibreglass Reinforced Polymer | |
| Pitch | 2.5mm | |
| Contact Material | Phosphor Bronze | |
| Mount Type | Board | |
| Contact Plating | Gold | |
| Termination Type | Press Fit | |
| Minimum Operating Temperature | -65°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | UL 94V-0 | |
| Series | Z-PACK HM-Zd | |
| 選取全部 | ||
|---|---|---|
品牌 TE Connectivity | ||
Product Type Backplane Connector | ||
Backplane Connector Type High Speed | ||
Number of Contacts 60 | ||
Current 0.7A | ||
Orientation Vertical | ||
Number of Columns 10 | ||
Connector Gender Male | ||
Number of Rows 6 | ||
Voltage 250V | ||
Housing Material Fibreglass Reinforced Polymer | ||
Pitch 2.5mm | ||
Contact Material Phosphor Bronze | ||
Mount Type Board | ||
Contact Plating Gold | ||
Termination Type Press Fit | ||
Minimum Operating Temperature -65°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals UL 94V-0 | ||
Series Z-PACK HM-Zd | ||
- COO (Country of Origin):
- CN
The TE Connectivity 60 Position High Speed Backplane Connector is a vertical PCB mount header designed for high-speed data transmission in modular systems. It features a 6-row by 10-column layout with partially shrouded housing, ensuring secure mating and alignment. This connector belongs to the Z-PACK HS3 series and supports up to 1 Gb/s data rates, making it suitable for telecom, computing, and industrial applications.
Vertical PCB mount header configuration for efficient board stacking
Partially shrouded housing with polarization for reliable mating alignment
2.5 mm centerline pitch supports high-speed signal transmission
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