Bergquist TGP 3000 Series Self-Adhesive Thermal Gap Pad, 0.01in Thick, 3W/m·K, Silicone, 16 x 8 x 0.01in
- RS庫存編號:
- 282-6765
- 製造零件編號:
- GAP PAD TGP 3000, 16in x 8in x 0.01 sh
- 製造商:
- Bergquist
小計(1 件)*
TWD3,084.00
(不含稅)
TWD3,238.20
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年3月02日 發貨
**需要更多嗎?**輸入您需要的數量,然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 |
|---|---|
| 1 + | TWD3,084.00 |
* 參考價格
- RS庫存編號:
- 282-6765
- 製造零件編號:
- GAP PAD TGP 3000, 16in x 8in x 0.01 sh
- 製造商:
- Bergquist
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Bergquist | |
| Dimensions | 16 x 8 x 0.01in | |
| Thickness | 0.01in | |
| Length | 16in | |
| Width | 8in | |
| Thermal Conductivity | 3W/m·K | |
| Material | Silicone | |
| Self-Adhesive | Yes | |
| Series | TGP 3000 | |
| 選取全部 | ||
|---|---|---|
品牌 Bergquist | ||
Dimensions 16 x 8 x 0.01in | ||
Thickness 0.01in | ||
Length 16in | ||
Width 8in | ||
Thermal Conductivity 3W/m·K | ||
Material Silicone | ||
Self-Adhesive Yes | ||
Series TGP 3000 | ||
豁免
- COO (Country of Origin):
- US
The Bergquist Thermally Conductive, Reinforced, Soft S-Class Gap Filling Material. It is a soft gap filling material rated at a thermal conductivity of 3 W/m-K. The material offers exceptional thermal performance at low pressures due to an all new 3 W/m-K filler package and low-modulus resin formulation. It is reinforced to enhance material handling, puncture, shear and tear resistance. It is well suited for high performance, low-stress applications that typically use fixed standoff or clip mounting. It maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and or topography.
Highly conformable
Designed for low-stress applications
Designed for low-stress applications
相關連結
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