Bergquist TGP 3000 Series Self-Adhesive Thermal Gap Pad, 0.01in Thick, 3W/m·K, Silicone, 16 x 8 x 0.01in

小計(1 件)*

TWD3,084.00

(不含稅)

TWD3,238.20

(含稅)

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  • 2026年3月02日 發貨
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RS庫存編號:
282-6765
製造零件編號:
GAP PAD TGP 3000, 16in x 8in x 0.01 sh
製造商:
Bergquist
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品牌

Bergquist

Dimensions

16 x 8 x 0.01in

Thickness

0.01in

Length

16in

Width

8in

Thermal Conductivity

3W/m·K

Material

Silicone

Self-Adhesive

Yes

Series

TGP 3000

豁免

COO (Country of Origin):
US
The Bergquist Thermally Conductive, Reinforced, Soft S-Class Gap Filling Material. It is a soft gap filling material rated at a thermal conductivity of 3 W/m-K. The material offers exceptional thermal performance at low pressures due to an all new 3 W/m-K filler package and low-modulus resin formulation. It is reinforced to enhance material handling, puncture, shear and tear resistance. It is well suited for high performance, low-stress applications that typically use fixed standoff or clip mounting. It maintains a conformable yet elastic nature that allows for excellent interfacing and wet-out characteristics, even to surfaces with high roughness and or topography.

Highly conformable
Designed for low-stress applications

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