Bergquist TGP 2000 Series Self-Adhesive Thermal Gap Pad, 0.02in Thick, 2W/m·K, Silicone, 16 x 8 x 0.02in

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TWD5,411.00

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TWD5,681.55

(含稅)

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RS庫存編號:
282-6743
製造零件編號:
GAP PAD TGP 2000, 16in x 8in x 0.02 sh
製造商:
Bergquist
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品牌

Bergquist

Dimensions

16 x 8 x 0.02in

Thickness

0.02in

Length

16in

Width

8in

Thermal Conductivity

2W/m·K

Material

Silicone

Self-Adhesive

Yes

Series

TGP 2000

豁免

COO (Country of Origin):
US
The Bergquist Highly Conformable, Thermally Conductive, Reinforced S-Class Gap Filling Material. It is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances.

Highly Conformable
Low hardness
Designed for low-stress applications
Fiberglass reinforced for puncture, shear and tear resistance

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