VPG Foil Resistors VSMP 500 Ω, 0805 Metal Foil Surface Mount Resistor ±0.01 % 0.2 W - Y1624500R000T9R
- RS庫存編號:
- 173-2911
- 製造零件編號:
- Y1624500R000T9R
- 製造商:
- VPG Foil Resistors
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- RS庫存編號:
- 173-2911
- 製造零件編號:
- Y1624500R000T9R
- 製造商:
- VPG Foil Resistors
規格
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產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | VPG Foil Resistors | |
| Resistance | 500Ω | |
| Product Type | Surface Mount Resistor | |
| Technology | Metal Foil | |
| Resistor Type | Precision | |
| Package/Case | 0805 | |
| Packaging | Tape & Reel | |
| Tolerance | ±0.01 % | |
| Voltage | 40V | |
| Power Rating | 0.2W | |
| Temperature Coefficient | -0.2 ppm/°C, +0.2 ppm/°C | |
| Automotive Standard | No | |
| Series | VSMP | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 125°C | |
| Height | 0.64mm | |
| Standards/Approvals | RoHS | |
| Length | 2.03mm | |
| Width | 1.27mm | |
| Termination Style | Solder | |
| 選取全部 | ||
|---|---|---|
品牌 VPG Foil Resistors | ||
Resistance 500Ω | ||
Product Type Surface Mount Resistor | ||
Technology Metal Foil | ||
Resistor Type Precision | ||
Package/Case 0805 | ||
Packaging Tape & Reel | ||
Tolerance ±0.01 % | ||
Voltage 40V | ||
Power Rating 0.2W | ||
Temperature Coefficient -0.2 ppm/°C, +0.2 ppm/°C | ||
Automotive Standard No | ||
Series VSMP | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 125°C | ||
Height 0.64mm | ||
Standards/Approvals RoHS | ||
Length 2.03mm | ||
Width 1.27mm | ||
Termination Style Solder | ||
VSMP Series Ultra High Precision Z Foil Wraparound SMD Chip Resistors
VSMP Series ultra high precision Z Foil surface mount chip resistors offering proven reliability and excellent stability under different environmental conditions. The VSMP’s full wraparound terminations ensure safe handling during the manufacturing process and provides stability during multiple thermal cycles. Applications for the VSMP resistor include; Automatic test equipment (ATE); high precision instrumentation; laboratory, industrial and medical; Audio; EB applications; Military and Space; Airborne; Down-hole instrumentation; Communication