ROHM 150 V 20 A Diode 3-Pin TO-277A RB218RSM15STL1
- RS庫存編號:
- 265-168
- 製造零件編號:
- RB218RSM15STL1
- 製造商:
- ROHM
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
小計（1 組，共 10 件）*
TWD428.00
(不含稅)
TWD449.40
(含稅)
庫存資訊目前無法存取 - 請稍後再回來查看
單位 | 每單位 | 每膠帶* |
|---|---|---|
| 10 - 90 | TWD42.80 | TWD428.00 |
| 100 - 240 | TWD40.70 | TWD407.00 |
| 250 - 490 | TWD37.70 | TWD377.00 |
| 500 - 990 | TWD34.70 | TWD347.00 |
| 1000 + | TWD33.40 | TWD334.00 |
* 參考價格
- RS庫存編號:
- 265-168
- 製造零件編號:
- RB218RSM15STL1
- 製造商:
- ROHM
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | ROHM | |
| Mount Type | Through Hole | |
| Product Type | Diode | |
| Package Type | TO-277A | |
| Maximum Continuous Forward Current If | 20A | |
| Peak Reverse Repetitive Voltage Vrrm | 150V | |
| Series | RB218 | |
| Pin Count | 3 | |
| Peak Reverse Current Ir | 8.3μA | |
| Minimum Operating Temperature | -55°C | |
| Peak Non-Repetitive Forward Surge Current Ifsm | 270A | |
| Maximum Forward Voltage Vf | 0.9V | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | RoHS | |
| Automotive Standard | No | |
| 選取全部 | ||
|---|---|---|
品牌 ROHM | ||
Mount Type Through Hole | ||
Product Type Diode | ||
Package Type TO-277A | ||
Maximum Continuous Forward Current If 20A | ||
Peak Reverse Repetitive Voltage Vrrm 150V | ||
Series RB218 | ||
Pin Count 3 | ||
Peak Reverse Current Ir 8.3μA | ||
Minimum Operating Temperature -55°C | ||
Peak Non-Repetitive Forward Surge Current Ifsm 270A | ||
Maximum Forward Voltage Vf 0.9V | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals RoHS | ||
Automotive Standard No | ||
The ROHM Schottky Barrier Diode, designed for high reliability applications, is the ideal choice for your switching power supply needs. Its innovative power mold design enhances its thermal performance, making it suitable for a wide range of electronic equipment. With robust specifications that allow for peak currents of up to 270 A and a maximal reverse voltage of 150 V, this diode provides outstanding reliability in demanding environments.
Thermal resistance characteristics optimise heat dissipation in compact spaces
Embossed tape packaging facilitates seamless integration into automated production processes
Wide operational temperature range allows for versatile application in various environments
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