Molex PMC Mezzanine Series Straight Surface PCB Socket, 64-Contact, 2 Row, 1 mm Pitch Solder
- RS庫存編號:
- 797-6617
- Distrelec 貨號:
- 303-00-026
- 製造零件編號:
- 71439-0864
- 製造商:
- Molex
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
小計（1 件）*
TWD177.00
(不含稅)
TWD185.85
(含稅)
訂單超過 $1,300.00 免費送貨
有庫存
- 加上 125 件從 2026年2月23日 起發貨
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單位 | 每單位 |
|---|---|
| 1 - 24 | TWD177.00 |
| 25 - 99 | TWD173.00 |
| 100 - 249 | TWD167.00 |
| 250 - 499 | TWD164.00 |
| 500 + | TWD161.00 |
* 參考價格
- RS庫存編號:
- 797-6617
- Distrelec 貨號:
- 303-00-026
- 製造零件編號:
- 71439-0864
- 製造商:
- Molex
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Number of Contacts | 64 | |
| Product Type | PCB Socket | |
| Sub Type | PCB Socket | |
| Number of Rows | 2 | |
| Pitch | 1mm | |
| Current | 1A | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Connector System | Board-to-Board | |
| Voltage | 100 V | |
| Series | PMC Mezzanine | |
| Row Pitch | 1mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Plating | Gold | |
| Contact Material | Phosphor Bronze | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | RoHS | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Number of Contacts 64 | ||
Product Type PCB Socket | ||
Sub Type PCB Socket | ||
Number of Rows 2 | ||
Pitch 1mm | ||
Current 1A | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Straight | ||
Connector System Board-to-Board | ||
Voltage 100 V | ||
Series PMC Mezzanine | ||
Row Pitch 1mm | ||
Minimum Operating Temperature -55°C | ||
Contact Plating Gold | ||
Contact Material Phosphor Bronze | ||
Contact Gender Male | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals RoHS | ||
- COO (Country of Origin):
- US
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component
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