Molex PMC Mezzanine Series Straight Surface PCB Socket, 64-Contact, 2 Row, 1 mm Pitch Solder
- RS庫存編號:
- 797-6617
- Distrelec 貨號:
- 303-00-026
- 製造零件編號:
- 71439-0864
- 製造商:
- Molex
可享批量折扣
小計（1 件）*
TWD177.00
(不含稅)
TWD185.85
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 125 件從 2026年2月23日 起裝運發貨
**需要更多嗎？**輸入您需要的數量，然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 |
|---|---|
| 1 - 24 | TWD177.00 |
| 25 - 99 | TWD173.00 |
| 100 - 249 | TWD167.00 |
| 250 - 499 | TWD164.00 |
| 500 + | TWD161.00 |
* 參考價格
- RS庫存編號:
- 797-6617
- Distrelec 貨號:
- 303-00-026
- 製造零件編號:
- 71439-0864
- 製造商:
- Molex
規格
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選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Number of Contacts | 64 | |
| Product Type | PCB Socket | |
| Number of Rows | 2 | |
| Sub Type | PCB Socket | |
| Pitch | 1mm | |
| Current | 1A | |
| Termination Type | Solder | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Connector System | Board-to-Board | |
| Voltage | 100 V | |
| Series | PMC Mezzanine | |
| Minimum Operating Temperature | -55°C | |
| Row Pitch | 1mm | |
| Contact Plating | Gold | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 85°C | |
| Contact Material | Phosphor Bronze | |
| Standards/Approvals | RoHS | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Number of Contacts 64 | ||
Product Type PCB Socket | ||
Number of Rows 2 | ||
Sub Type PCB Socket | ||
Pitch 1mm | ||
Current 1A | ||
Termination Type Solder | ||
Mount Type Surface | ||
Orientation Straight | ||
Connector System Board-to-Board | ||
Voltage 100 V | ||
Series PMC Mezzanine | ||
Minimum Operating Temperature -55°C | ||
Row Pitch 1mm | ||
Contact Plating Gold | ||
Contact Gender Male | ||
Maximum Operating Temperature 85°C | ||
Contact Material Phosphor Bronze | ||
Standards/Approvals RoHS | ||
- COO (Country of Origin):
- US
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component
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