TE Connectivity Z-PACK HM Series Straight Through Hole Mount PCB Socket, 3-Contact, Solder Termination

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小計(1 件)*

TWD141.00

(不含稅)

TWD148.05

(含稅)

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1 - 14TWD141.00
15 - 23TWD137.00
24 - 35TWD134.00
36 - 59TWD131.00
60 +TWD125.00

* 參考價格

包裝方式:
RS庫存編號:
718-1538
製造零件編號:
5-5223955-2
製造商:
TE Connectivity
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品牌

TE Connectivity

Number of Contacts

3

Type

Board to Board

Mounting Type

Through Hole

Body Orientation

Straight

Termination Method

Solder

Current Rating

1.15A

Voltage Rating

250 V ac

Series

Z-PACK HM

Contact Material

Copper

COO (Country of Origin):
US

Z-PACK™ HS3 Connectors


The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

For these non-cancellable (NC), and non-returnable (NR) products, Terms and Conditions apply.



The Z-PACK 2 mm HM Interconnection System is designed as a two part system for the connection of free boards (Daughterboards or PCBs) to fixed boards (Motherboards, Backplane or Backpanel) and feed the connection through the fixed board.

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