TE Connectivity Z-PACK HM Series Straight Through Hole PCB Socket, 3-Contact, 2.54 mm Pitch Solder
- RS庫存編號:
- 718-1538
- 製造零件編號:
- 5-5223955-2
- 製造商:
- TE Connectivity
此圖片僅供參考，請參閲產品詳細資訊及規格
可享批量折扣
小計（1 件）*
TWD141.00
(不含稅)
TWD148.05
(含稅)
訂單超過 $1,300.00 免費送貨
最後的 RS 庫存
- 最終 110 個，準備發貨
單位 | 每單位 |
|---|---|
| 1 - 14 | TWD141.00 |
| 15 - 23 | TWD137.00 |
| 24 - 35 | TWD134.00 |
| 36 - 59 | TWD131.00 |
| 60 + | TWD125.00 |
* 參考價格
- RS庫存編號:
- 718-1538
- 製造零件編號:
- 5-5223955-2
- 製造商:
- TE Connectivity
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | TE Connectivity | |
| Product Type | PCB Socket | |
| Number of Contacts | 3 | |
| Sub Type | Board-to-Board | |
| Current | 1.15A | |
| Pitch | 2.54mm | |
| Termination Type | Solder | |
| Housing Material | Liquid Crystal Polymer | |
| Mount Type | Through Hole | |
| Orientation | Straight | |
| Connector System | Board-to-Board | |
| Voltage | 250 V | |
| Series | Z-PACK HM | |
| Minimum Operating Temperature | -65°C | |
| Contact Gender | Female | |
| Contact Plating | Gold | |
| Contact Material | Copper | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | RoHS | |
| 選取全部 | ||
|---|---|---|
品牌 TE Connectivity | ||
Product Type PCB Socket | ||
Number of Contacts 3 | ||
Sub Type Board-to-Board | ||
Current 1.15A | ||
Pitch 2.54mm | ||
Termination Type Solder | ||
Housing Material Liquid Crystal Polymer | ||
Mount Type Through Hole | ||
Orientation Straight | ||
Connector System Board-to-Board | ||
Voltage 250 V | ||
Series Z-PACK HM | ||
Minimum Operating Temperature -65°C | ||
Contact Gender Female | ||
Contact Plating Gold | ||
Contact Material Copper | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals RoHS | ||
- COO (Country of Origin):
- US
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
The Z-PACK 2 mm HM Interconnection System is designed as a two part system for the connection of free boards (Daughterboards or PCBs) to fixed boards (Motherboards, Backplane or Backpanel) and feed the connection through the fixed board.
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