Samtec SEAF Series Straight Surface Mount PCB Socket, 240-Contact, 8-Row, 1.27mm Pitch, Solder Termination
- RS庫存編號:
- 158-7752
- 製造零件編號:
- SEAF-30-05.0-S-08-2-A-K-TR
- 製造商:
- Samtec
當前暫無庫存,可於24/05/2024發貨,6 工作日送達。
已增加
單價(不含稅) 個
TWD552.00
(不含稅)
TWD579.60
(含稅)
單位 | Per unit |
1 - 62 | TWD552.00 |
63 + | TWD538.00 |
- RS庫存編號:
- 158-7752
- 製造零件編號:
- SEAF-30-05.0-S-08-2-A-K-TR
- 製造商:
- Samtec
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
1.27mm SEARAY™ Series Interconnects
SEARAY™ is a 1.27mm high density, high speed board-to-board interconnect system. These SEAM / SEAF Series connectors can be mapped as a single-ended application, differential pair application, or a combination of both. When routed as a single-ended system, SEARAY™ is rated at 12.5 GHz @ -3dB. The SEAM / SEAF Series of High Speed / High Density Open Pin Field Array employs Solder Charge Technology for improved solder joint reliability. These SEAM SEAF Series SEARAY™ High Speed / High Density Open Pin Field Array use the Samtec Edge Rate contact system which gives high speed performance, zippering when mating and unmating as well as lowering insertion and extraction forces.
Various rows high density connectors suitable for board stacking applications
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area
Stack height dependant upon SEAF/SEAM combination from 7 mm
Contact resistance: 5.5 mΩ
Contact Plating: 0.76 μm Gold on contact area with Matte Tin on tail area
This open pin field array socket features a 1.27 mm x 1.27 mm pitch grid with up to 500 total I/Os. The rugged Edge Rate® contact system is signal integrity optimized with solder charged terminations for ease of processing. SEAF is a 28+ Gbps performance interconnect with low insertion/extraction forces and stack heights from 7 mm to 17.5 mm.
Up to 500 I/Os
.050" (1.27 mm) pitch
Rugged Edge Rate® contact
Lower insertion/withdrawal forces
Solder charge termination
7 mm - 17.5 mm stack heights
Dual sourced by Molex®
Samtec 28+ Gbps Solution
.050" (1.27 mm) pitch
Rugged Edge Rate® contact
Lower insertion/withdrawal forces
Solder charge termination
7 mm - 17.5 mm stack heights
Dual sourced by Molex®
Samtec 28+ Gbps Solution
For products that are Customized and under Non-cancellable & Non-returnable, Sales & Conditions apply.
規格
屬性 | 值 |
---|---|
Number of Contacts | 240 |
Number of Rows | 8 |
Pitch | 1.27mm |
Type | Board to Board |
Mounting Type | Surface Mount |
Body Orientation | Straight |
Stacking Height | 7mm |
Termination Method | Solder |
Current Rating | 1.8A |
Voltage Rating | 240 V |
Series | SEAF |
Contact Material | Copper |