Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 4 Contact(s), 3 mm Pitch, 1 Row, Shrouded

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TWD169.05

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包裝方式:
RS庫存編號:
670-4733
製造零件編號:
43650-0400
製造商:
Molex
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品牌

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Current

5A

Pitch

3mm

Housing Material

Thermoplastic

Number of Contacts

4

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Through Hole

Contact Material

Brass

Contact Plating

Tin

Termination Type

Solder

Row Pitch

3mm

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

No

Voltage

250 V

Distrelec Product Id

304-33-550

Molex Micro-Fit 3.0 Series PCB Header, 3mm Pitch, 4 Contacts - 43650-0400


This PCB header is specifically designed for efficient wire-to-board connections. It features a right-angle orientation and comes equipped with four circuits to accommodate various electrical needs. The shrouded design enhances security against accidental disengagement, making it suitable for automated applications in the electrical and mechanical industries.

Features & Benefits


• Compatible with surface mount applications for versatile integration

• Shrouded design prevents misalignment during connection

• High-temperature thermoplastic ensures durability under extreme conditions

• Supports up to 8.5A current rating for reliable performance

• Through-hole termination method simplifies installation process

• Glow wire compliant for enhanced safety in high-heat environments

Applications


• Ideal for power distribution in electronic devices

• Suitable for connections in automation equipment

• Utilised in consumer electronics for reliable power transfer

• Employed in control systems requiring robust interconnection

What is the recommended PCB thickness for optimal performance?


The ideal PCB thickness for this connector is 1.60mm, ensuring secure mounting and electrical reliability.

How does the shrouded design benefit connectivity?


The shrouded design enhances the connector's stability, reducing the risk of misalignment and ensuring a secure fit during operation.

What type of solder process can be used with this header?


It can be used in both SMC and wave solder processes, allowing for flexibility during assembly.

What operating temperature range can this connector withstand?


It is capable of operating within a temperature range of -40°C to +105°C, making it suitable for various environments.

What materials are used for contact plating and why is it important?


The contacts are plated with tin, which provides good conductivity and resistance to corrosion, ensuring long-lasting performance in demanding applications.

Molex Micro-Fit 3.0 3.0mm Single Row PCB Headers with Snap in Plastic Peg PCB Lock, 43650 Series


Micro-Fit 3.0 3mm pitch wire to board single row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, snap-in plastic peg PCB locks are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs

Features and Benefits


• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Through hole versions SMT compatible

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Plastic peg PCB locks for secure connection to PCB

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals

Molex Micro-Fit 3.0 Series


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