Molex C-Grid III Series Vertical Through Hole PCB Header, 4 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded
- RS庫存編號:
- 170-7066
- 製造零件編號:
- 90136-1204
- 製造商:
- Molex
此圖片僅供參考,請參閲產品詳細資訊及規格
可享批量折扣
小計(1 托盤,共 1920 件)*
TWD60,096.00
(不含稅)
TWD63,091.20
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年6月22日 發貨
**需要更多嗎?**輸入您需要的數量,然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每托盤* |
|---|---|---|
| 1920 - 7680 | TWD31.30 | TWD60,096.00 |
| 9600 + | TWD30.60 | TWD58,752.00 |
* 參考價格
- RS庫存編號:
- 170-7066
- 製造零件編號:
- 90136-1204
- 製造商:
- Molex
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Series | C-Grid III | |
| Product Type | PCB Header | |
| Current | 3A | |
| Pitch | 2.54mm | |
| Housing Material | Polyester | |
| Number of Contacts | 4 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Material | Brass | |
| Contact Plating | Gold | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Solder | |
| Row Pitch | 2.54mm | |
| Maximum Operating Temperature | 125°C | |
| Tail Pin Length | 2.9mm | |
| Contact Gender | Male | |
| Mating Pin Length | 6.75mm | |
| Standards/Approvals | No | |
| Voltage | 350 V | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Series C-Grid III | ||
Product Type PCB Header | ||
Current 3A | ||
Pitch 2.54mm | ||
Housing Material Polyester | ||
Number of Contacts 4 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Material Brass | ||
Contact Plating Gold | ||
Minimum Operating Temperature -55°C | ||
Termination Type Solder | ||
Row Pitch 2.54mm | ||
Maximum Operating Temperature 125°C | ||
Tail Pin Length 2.9mm | ||
Contact Gender Male | ||
Mating Pin Length 6.75mm | ||
Standards/Approvals No | ||
Voltage 350 V | ||
Molex C-Grid III Series PCB Header, 3A Current Rating, 2.54mm Pitch - 90136-1204
This PCB header facilitates reliable wire-to-board connections in electronic applications. The C-Grid III series features a shrouded design for improved safety and connectivity. Its single-row configuration and vertical orientation simplify integration into various circuit boards, ensuring smooth operation in challenging environments.
Features & Benefits
• Gold plating on contacts assures good conductivity
• Rated for 3A current, suitable for various uses
• High voltage rating of 350V extends application range
Applications
• Used for signal connections in automation systems
• Designed for interfacing in electrical control panels
• Commonly applied in consumer electronics for board interconnections
• Ideal for telecommunications equipment
How can the solder connections be ensured to last long?
Using appropriate solder techniques alongside clean solder pads enhances joint reliability and longevity.
What type of tools are suitable for installation?
Standard soldering tools for through hole components can effectively be used for installation.
Are there specific mounting guidelines for optimal performance?
A recommended PCB thickness of 1.60mm can optimise performance and ensure secure mounting.
What are the consequences of exceeding the current rating?
Exceeding the current rating can result in overheating and potential failure of the connection.
Standards
DIN 41651; HE13/14
相關連結
- Molex C-Grid III Series Vertical Through Hole PCB Header 2.54 mm Pitch Shrouded
- Molex C-Grid III Series Straight Through Hole PCB Header 2.54 mm Pitch Shrouded
- Molex C-Grid III Series Straight Through Hole PCB Header 2.54 mm Pitch Shrouded
- Molex C-Grid III Series Straight Through Hole PCB Header 2.54 mm Pitch Shrouded
- Molex C-Grid III Series Straight Through Hole PCB Header 2.54 mm Pitch Shrouded
- Molex C-Grid III Series Straight Through Hole PCB Header 2.54 mm Pitch Shrouded
- Molex C-Grid III Series Straight Through Hole PCB Header 2.54 mm Pitch Shrouded
- Molex C-Grid III Series Straight Through Hole PCB Header 2.54 mm Pitch Shrouded
