Molex C-Grid III Series Vertical Through Hole PCB Header, 8 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded
- RS庫存編號:
- 170-7064
- 製造零件編號:
- 90131-0764
- 製造商:
- Molex
此圖片僅供參考,請參閲產品詳細資訊及規格
可享批量折扣
小計(1 托盤,共 800 件)*
TWD33,360.00
(不含稅)
TWD35,024.00
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 從 2026年6月15日 發貨
**需要更多嗎?**輸入您需要的數量,然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每托盤* |
|---|---|---|
| 800 - 3200 | TWD41.70 | TWD33,360.00 |
| 4000 + | TWD37.60 | TWD30,080.00 |
* 參考價格
- RS庫存編號:
- 170-7064
- 製造零件編號:
- 90131-0764
- 製造商:
- Molex
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | Molex | |
| Series | C-Grid III | |
| Product Type | PCB Header | |
| Pitch | 2.54mm | |
| Current | 3A | |
| Housing Material | Polyester | |
| Number of Contacts | 8 | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Through Hole | |
| Contact Material | Brass | |
| Contact Plating | Gold | |
| Termination Type | Solder | |
| Row Pitch | 2.54mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 125°C | |
| Tail Pin Length | 2.9mm | |
| Mating Pin Length | 6.75mm | |
| Standards/Approvals | No | |
| Voltage | 350 V | |
| 選取全部 | ||
|---|---|---|
品牌 Molex | ||
Series C-Grid III | ||
Product Type PCB Header | ||
Pitch 2.54mm | ||
Current 3A | ||
Housing Material Polyester | ||
Number of Contacts 8 | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Connector System Wire-to-Board | ||
Mount Type Through Hole | ||
Contact Material Brass | ||
Contact Plating Gold | ||
Termination Type Solder | ||
Row Pitch 2.54mm | ||
Minimum Operating Temperature -55°C | ||
Contact Gender Male | ||
Maximum Operating Temperature 125°C | ||
Tail Pin Length 2.9mm | ||
Mating Pin Length 6.75mm | ||
Standards/Approvals No | ||
Voltage 350 V | ||
Molex C-Grid III Series PCB Header, 2.54mm Pitch, 8 Contacts - 90131-0764
This PCB header is a C-Grid III connector designed for versatile applications within the electronics sector. With a pitch of 2.54mm, it features a dual-row layout accommodating 8 circuits and operates with a vertical orientation. This through-hole PCB header is constructed from durable brass and features a gold-plated finish for enhanced conductivity.
Features & Benefits
• 8 contact PCB header ensures reliable connections
• 3A current rating supports various low-power applications
• 350V voltage rating enhances durability in demanding environments
• Vertical design facilitates space-efficient circuit layouts
• Unshrouded connectors simplify component placement
• Compatibility with wire-to-board configurations for enhanced versatility
Applications
• Utilised in automation and control systems
• Ideal for electronic devices requiring reliable signal connections
• Employed in industrial machinery for robust wiring solutions
• Suitable for custom circuit board designs in varied environments
What is the significance of the gold plating in the connector?
Gold plating improves conductivity and resistance to corrosion, ensuring long-lasting performance and reliability in signal transmission.
How does the vertical orientation benefit circuit design?
The vertical orientation allows for compact arrangements, making it easier to fit within tight spaces and enabling efficient board layout designs.
Is the connector suitable for high-temperature applications?
Yes, it operates within a temperature range from -55°C to +125°C, making it suitable for diverse settings, including high-temperature environments.
Can this header be used for both signal and power transmission?
Yes, it serves effectively for both signal and low-power transmission applications, providing flexibility in circuit design.
What is the maximum process temperature for soldering?
The header can withstand a maximum process temperature of 230°C during soldering, ensuring reliable installation.
Molex C-Grid III 2.54 mm PCB Pin Headers - 90120, 90121, 90122 and 90131 Series
90120, 90121, 90122 and 90131 series PCB headers that form part of the 2.54 mm C-Grid III interconnection system designed to meet the latest industry requirements. These C-Grid III PCB headers mate with C-Grid III series PCB sockets and crimp housings for use in both board to board and wire to board applications. The headers have a breakaway design and can be cut to size for additional design flexibility. The pins of these PCB pin headers have a high retention force for a secure mating connection. The contacts, once soldered to the PCB also have a high mechanical stability. These 2.54 mm C-Grid PCB pin headers are available in single and dual row, vertical and right angle mounting configurations to suit a range of interconnection requirements.
Features and Benefits
• Suitable for use in board to board and wire to board applications
• Breakaway feature for design flexibility
• High pin retention force for secure mating connection
• High mechanical stability once soldered
Product Application Information
C-Grid III series connectors are suitable for use in the industrial, computer, medical, consumer, telecommunications and transportation industry. Applications include Desktop PCs, servers, monitors, medical equipment, white goods, exchange stations, industrial equipment and automotive safety systems and electronics.
2.54mm Molex C-Grid III Range
Standards
DIN 41651; HE13/14
相關連結
- Molex C-Grid III Series Vertical Through Hole PCB Header 2.54 mm Pitch Unshrouded
- Molex C-Grid III Series Vertical Through Hole PCB Header 2.54 mm Pitch Unshrouded
- Molex C-Grid III Series Straight Through Hole Pin Header 2.54 mm Pitch Unshrouded
- Molex C-Grid III Series Right Angle Through Hole Pin Header 2.54 mm Pitch Unshrouded
- Molex C-Grid III Series Right Angle Through Hole Pin Header 2.54 mm Pitch Unshrouded
- Molex C-Grid III Series Straight Through Hole Pin Header 2.54 mm Pitch Unshrouded
- Molex C-Grid III Series Straight Through Hole Pin Header 2.54 mm Pitch Unshrouded
- Molex C-Grid III Series Straight Through Hole Pin Header 2.54 mm Pitch Unshrouded
