Molex 43650 Series Right Angle Surface Mount PCB Header, 10 Contact(s), 3 mm Pitch, 1 Row, Shrouded

N

此圖片僅供參考,請參閲產品詳細資訊及規格

小計(1 卷,共 320 件)*

TWD44,686.00

(不含稅)

TWD46,920.30

(含稅)

Add to Basket
選擇或輸入數量
暫時缺貨
  • 2026年1月27日 發貨
**需要更多嗎?**輸入您需要的數量,然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
每卷
每單位*
1 +TWD44,686.00TWD139.644

* 參考價格

RS庫存編號:
691-618
製造零件編號:
43650-1010
製造商:
Molex
透過選取一個或多個屬性來查找類似產品。
選取全部

品牌

Molex

Product Type

PCB Header

Series

43650

Current

8.5A

Pitch

3mm

Number of Contacts

10

Housing Material

High Temperature Thermoplastic

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Mount Type

Surface Mount

Connector System

Wire-to-Board

Contact Plating

Gold

Contact Material

Brass

Minimum Operating Temperature

-40°C

Termination Type

Surface Mount

Maximum Operating Temperature

125°C

Standards/Approvals

CSA LR19980, UL E29179

COO (Country of Origin):
CN
The Molex Micro-Fit 3.0 Right-Angle Header is engineered for demanding environments where reliability and performance are paramount. This connector features a Compact design with a 3.00mm pitch and supports 10 circuits, making it Ideal for power and data transfer in various applications. Enhanced with a PCB press-fit metal retention clip, it ensures a robust connection while accommodating high-temperature scenarios. The product complies with stringent industry standards, including EU RoHS and Low-Halogen regulations, ensuring environmental compatibility. With a durability rating of 30 mating cycles and a wide operating temperature range of -40° to +125°C, this header is perfectly suited for applications that endure extreme conditions, making it an excellent choice for both commercial and industrial uses.

Operating temperature range from -40° to +125°C for extreme environment compatibility
Complies with EU RoHS and Low-Halogen requirements for environmental safety
Black resin housing offers a professional appearance and durability
Fully shrouded design provides additional protection against accidental disconnection
Optimized for wire-to-board power applications, ensuring efficient energy transfer

相關連結