TE Connectivity, 1-2199298 2.54mm Pitch Straight 14 Way, Through Hole Standard Pin Ladder IC Dip Socket, 1A
- RS庫存編號:
- 164-6099
- 製造零件編號:
- 1-2199298-3
- 製造商:
- TE Connectivity
此圖片僅供參考,請參閲產品詳細資訊及規格
可享批量折扣
小計(1 管,共 3400 件)*
TWD16,660.00
(不含稅)
TWD17,476.00
(含稅)
訂單超過 $1,300.00 免費送貨
暫時缺貨
- 3,400 件從 2026年2月09日 起裝運發貨
**需要更多嗎?**輸入您需要的數量,然後按一下「查看送貨日期」以查詢更多庫存和送貨詳細資訊。
單位 | 每單位 | 每管* |
|---|---|---|
| 3400 - 13600 | TWD4.90 | TWD16,660.00 |
| 17000 + | TWD4.80 | TWD16,320.00 |
* 參考價格
- RS庫存編號:
- 164-6099
- 製造零件編號:
- 1-2199298-3
- 製造商:
- TE Connectivity
規格
產品概覽和技術數據資料表
法例與合規
產品詳細資訊
透過選取一個或多個屬性來查找類似產品。
選取全部 | 屬性 | 值 |
|---|---|---|
| 品牌 | TE Connectivity | |
| Number of Contacts | 14 | |
| Mounting Type | Through Hole | |
| Pin Type | Standard | |
| Pitch | 2.54mm | |
| Row Width | 7.62mm | |
| Frame Type | Ladder | |
| Termination Method | Solder | |
| Contact Plating | Tin over Nickel | |
| Current Rating | 1A | |
| Orientation | Straight | |
| Length | 17.78mm | |
| Width | 10mm | |
| Depth | 5.1mm | |
| Dimensions | 17.78 x 10 x 5.1mm | |
| Voltage Rating | 250 V ac/dc | |
| Housing Material | Glass Filled PBT, Thermoplastic | |
| Maximum Operating Temperature | +105°C | |
| Minimum Operating Temperature | -40°C | |
| Contact Material | Phosphor Bronze | |
| Series | 1-2199298 | |
| 選取全部 | ||
|---|---|---|
品牌 TE Connectivity | ||
Number of Contacts 14 | ||
Mounting Type Through Hole | ||
Pin Type Standard | ||
Pitch 2.54mm | ||
Row Width 7.62mm | ||
Frame Type Ladder | ||
Termination Method Solder | ||
Contact Plating Tin over Nickel | ||
Current Rating 1A | ||
Orientation Straight | ||
Length 17.78mm | ||
Width 10mm | ||
Depth 5.1mm | ||
Dimensions 17.78 x 10 x 5.1mm | ||
Voltage Rating 250 V ac/dc | ||
Housing Material Glass Filled PBT, Thermoplastic | ||
Maximum Operating Temperature +105°C | ||
Minimum Operating Temperature -40°C | ||
Contact Material Phosphor Bronze | ||
Series 1-2199298 | ||
- COO (Country of Origin):
- CN
TE Connectivity DIPLOMATE Dual Leaf PCB Mount DIP Socket
DIPLOMATE Dual Leaf (DL) DIP sockets with stamped and formed dual wiping contacts for vertical, through hole PCB mounting. These DIPLOMATE Dual Leaf (DL) DIP sockets have black thermoplastic GF stackable housings with a 2.54mm centreline, and a "true closed bottom" design which prevents solder or flux wicking and standoffs to allow board clearance for cleaning after soldering. The profiles for these DIPLOMATE Dual Leaf (DL) DIP sockets are all standard apart from part number 719-8817 which has an over-the-component profile. These DIPLOMATE DIP sockets are available with different frame styles with either straight or retention legs.
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